MC68HC16Z1CAG25 Freescale Semiconductor, MC68HC16Z1CAG25 Datasheet - Page 203

• Manufacturer Part Number: MC68HC16Z1CAG25
• Description: IC MCU 16BIT 25MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HC16r

Specifications of MC68HC16Z1CAG25

• Core Processor: CPU16
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Type: ROMless
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Cpu Family: HC16
• Device Core Size: 16b
• Frequency (max): 25MHz
• Interface Type: SCI/SPI/UART
• Program Memory Size: Not Required
• Total Internal Ram Size: 1KB
• # I/os (max): 16
• Number Of Timers - General Purpose: 11
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Controller Family/series: 68HC16
• No. Of I/o's: 16
• Ram Memory Size: 1KB
• Cpu Speed: 25MHz
• No. Of Timers: 2
• Embedded Interface Type: QSPI, SCI
• Rohs Compliant: Yes
• Processor Series: HC16Z
• Core: CPU16
• Data Bus Width: 16 bit
• Data Ram Size: 1 KB
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 11
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Compliant

M68HC16 Z SERIES
USER’S MANUAL
Grounding is the most important factor influencing analog circuit performance in mixed
signal systems (or in stand-alone analog systems). Close attention must be paid to
avoid introducing additional sources of noise into the analog circuitry. Common sourc-
es of noise include ground loops, inductive coupling, and combining digital and analog
grounds together inappropriately.
The problem of how and when to combine digital and analog grounds arises from the
large transients which the digital ground must handle. If the digital ground is not able
to handle the large transients, the current from the large transients can return to
ground through the analog ground. It is the excess current overflowing into the analog
ground which causes performance degradation by developing a differential voltage
between the true analog ground and the microcontroller’s ground pin. The end result
is that the ground observed by the analog circuit is no longer true ground and often
ends in skewed results.
Two similar approaches designed to improve or eliminate the problems associated
with grounding excess transient currents involve star-point ground systems. One ap-
proach is to star-point the different grounds at the power supply origin, thus keeping
the ground isolated. Refer to
Another approach is to star-point the different grounds near the analog ground pin on
the microcontroller by using small traces for connecting the non-analog grounds to the
analog ground. The small traces are meant only to accommodate DC differences, not
AC transients.
PCB
Figure 8-6 Star-Ground at the Point of Power Supply Origin
+5V
ANALOG POWER SUPPLY
Freescale Semiconductor, Inc.
AGND
ADC
For More Information On This Product,
ANALOG-TO-DIGITAL CONVERTER
Figure
Go to: www.freescale.com
+5V
VDD
VSS
8-6.
DIGITAL POWER SUPPLY
PGND
+5V
ADC POWER SCHEM
8-17