MC68HC16Z1CAG25 Freescale Semiconductor, MC68HC16Z1CAG25 Datasheet - Page 289

• Manufacturer Part Number: MC68HC16Z1CAG25
• Description: IC MCU 16BIT 25MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HC16r

Specifications of MC68HC16Z1CAG25

• Core Processor: CPU16
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Type: ROMless
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Cpu Family: HC16
• Device Core Size: 16b
• Frequency (max): 25MHz
• Interface Type: SCI/SPI/UART
• Program Memory Size: Not Required
• Total Internal Ram Size: 1KB
• # I/os (max): 16
• Number Of Timers - General Purpose: 11
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Controller Family/series: 68HC16
• No. Of I/o's: 16
• Ram Memory Size: 1KB
• Cpu Speed: 25MHz
• No. Of Timers: 2
• Embedded Interface Type: QSPI, SCI
• Rohs Compliant: Yes
• Processor Series: HC16Z
• Core: CPU16
• Data Bus Width: 16 bit
• Data Ram Size: 1 KB
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 11
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Compliant

M68HC16 Z SERIES
USER’S MANUAL
Num
The average chip-junction temperature (T
where:
For most applications P
P
Solving equations 1 and 2 for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation (3)
by measuring P
T
D
J
1
can be obtained by solving equations (1) and (2) iteratively for any value of T
and T
Thermal Resistance
T
P
P
P
A
D
INT
I/O
JA
Plastic 132-Pin Surface Mount
Plastic 144-Pin Surface Mount
= Ambient Temperature, C
J
= P
= Package Thermal Resistance, Junction-to-Ambient, C/W
= Power Dissipation on Input and Output Pins — User Determined
(if P
= I
K
INT
DD
=
I/O
D
P
(at equilibrium) for a known T
is neglected) is:
P
D
V
Freescale Semiconductor, Inc.
I/O
DD
Characteristic
For More Information On This Product,
Table A-6 Thermal Characteristics
, Watts — Chip Internal Power
I/O
T
P
A
ELECTRICAL CHARACTERISTICS
D
+
T
P
J
273 C
=
INT
=
Go to: www.freescale.com
K
and can be neglected. An approximate relationship between
T
A
+
T
+
J
P
+
J
D
JA
273 C
) in C can be obtained from:
P
A
JA
. Using this value of K, the values of P
D
2
(1)
(2)
(3)
Symbol
JA
Value
38
49
A
.
Unit
C/W
D
and
A-5