MPC564CZP40 Freescale Semiconductor, MPC564CZP40 Datasheet - Page 1219
MPC564CZP40
Manufacturer Part Number
MPC564CZP40
Description
IC MPU 32BIT W/CODE COMP 388PBGA
Manufacturer
Freescale Semiconductor
Series
MPC5xxr
Specifications of MPC564CZP40
Core Processor
PowerPC
Core Size
32-Bit
Speed
40MHz
Connectivity
CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
56
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 2.7 V
Data Converters
A/D 32x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
388-BGA
Processor Series
MPC5xx
Core
PowerPC
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
CAN, JTAG, QSPI, SCI, SPI, UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
56
Number Of Timers
2
Operating Supply Voltage
0 V to 5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (10 bit, 32 Channel)
For Use With
MPC564EVB - KIT EVAL FOR MPC561/562/563/564
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Lead Free Status / Rohs Status
No
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC564CZP40
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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F.2.2
EMC – Electromagnetic Compatibility
EMI – Electromagnetic Interference
TEM cell – Transverse Electromagnetic Mode cell
F.2.3
F.3
Freescale Semiconductor
1. Scan range: 150 KHz – 1000 MHz
2. Operating Frequency: 56 MHz
3. Operating Voltages: 2.6 V, 5.0 V
4. Max spikes: TBD dBuV
5. I/O port waveforms: Per J1752/3
6. Temperature: 25 °C
1
2
3
4
5
6
7
8
BGA Package Thermal Resistance,
Junction to Ambient – Natural Convection
BGA Package Thermal Resistance,
Junction to Ambient – Four layer (2s2p) board, natural
convection
BGA Package Thermal Resistance,
Junction to Board
BGA Package Thermal Resistance,
Junction to Case (top)
BGA Package Thermal Resistance,
Junction to Package Top, Natural Convection
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
the board thermal resistance.
Per SEMI G38-87 and JESD51-2 with the board horizontal.
These values are the mean + 3 standard deviations of characterized data.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
the board thermal resistance.
Per JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board (Four layer (2s2p) board, natural convection).
Indicates the thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature.
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per EIA/JESD51-2.
Thermal Characteristics
Definitions and Acronyms
EMI Testing Specifications
Characteristic
MPC561/MPC563 Reference Manual, Rev. 1.2
Table F-2. Thermal Characteristics
Symbol
R
R
R
R
Ψ
θJMA
θJA
θJB
θJT
JT
47.3
29.4
21.2
Value
7.0
1.6
1,2,3
3,4
3,7
8
3,6
,
5
Electrical Characteristics
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
F-3
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