BGW200EG/01,518 NXP Semiconductors, BGW200EG/01,518 Datasheet - Page 52

• Manufacturer Part Number: BGW200EG/01,518
• Description: IC WLAN SIP MOD 802.11B 68HVQFN
• Manufacturer: NXP Semiconductors
• Series: BGW200r

Specifications of BGW200EG/01,518

• Frequency: 2.4GHz ~ 2.5GHz
• Modulation Or Protocol: DBPSK, DQPSK, CCK
• Applications: PDA's, Portable Audio/Video, Smartphones
• Power - Output: 8dBm ~ 18dBm
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Package / Case: 68-VQFN Exposed Pad, 68-HVQFN, 68-SQFN, 68-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Current - Transmitting: -
• Current - Receiving: -
• Other names: 935279198518; BGW200EG/01-T; BGW200EG/01-T

NXP Semiconductors
BGW200EG_1
Product data sheet
Fig 20. Core supply current in receive mode as a
Fig 22. Digital I/O, analog RF and VCO supply current
I
I
DD(C)(rcv)
DDA(tx)
(mA)
(mA)
(1) V
(2) V
(3) V
(1) V
(2) V
(3) V
93.9
93.7
93.5
93.3
102
98
94
90
86
function of temperature
in transmit mode for 11 Mbit/s at fixed gain
setting CFh as a function of temperature
50
50
DD
DD
DD
DD
DD
DD
= 1.95 V
= 1.65 V
= 1.8 V
= 3.0 V
= 2.85 V
= 2.7 V
0
0
(1)
(2)
(3)
50
50
T
T
amb
amb
001aad205
001aad207
(2)
( C)
( C)
(1)
(3)
100
100
Rev. 01 — 18 July 2007
Fig 21. Digital I/O, analog RF and VCO supply current
Fig 23. Driver and power amplifier supply current for
I
DDA(rcv)
I
(mA)
(mA)
DDA2
(1) V
(2) V
(3) V
(1) V
(2) V
(3) V
120
116
112
108
104
175
165
155
145
135
in receive mode as a function of temperature
11 Mbit/s at fixed gain setting CFh as a function
of temperature
50
40
DD
DD
DD
DD
DD
DD
= 3.0 V
= 2.85 V
= 2.7 V
= 3.0 V
= 2.85 V
= 2.7 V
IEEE 802.11b System-in-Package
10
0
(1)
(2)
(3)
(1)
(2)
(3)
BGW200EG
50
60
T
T
© NXP B.V. 2007. All rights reserved.
amb
amb
001aad206
001aad208
( C)
( C)
100
110
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