BGW200EG/01,518 NXP Semiconductors, BGW200EG/01,518 Datasheet - Page 69

• Manufacturer Part Number: BGW200EG/01,518
• Description: IC WLAN SIP MOD 802.11B 68HVQFN
• Manufacturer: NXP Semiconductors
• Series: BGW200r

Specifications of BGW200EG/01,518

• Frequency: 2.4GHz ~ 2.5GHz
• Modulation Or Protocol: DBPSK, DQPSK, CCK
• Applications: PDA's, Portable Audio/Video, Smartphones
• Power - Output: 8dBm ~ 18dBm
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Package / Case: 68-VQFN Exposed Pad, 68-HVQFN, 68-SQFN, 68-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Current - Transmitting: -
• Current - Receiving: -
• Other names: 935279198518; BGW200EG/01-T; BGW200EG/01-T

NXP Semiconductors
BGW200EG_1
Product data sheet
16.3.1 Component removal
16.3 Rework
Table 75.
[1]
If rework is needed, then the packages can be removed or reworked using a ‘BGA’ repair
station.
The rework process involves the following steps:
These steps are discussed in the following sections in more details.
The first step in removal of a component is the reflow of solder joints. It is recommended
to preheat the PCB to 150 C using a bottom heater. Heating of the top side of the
component should be done using hot air while a special nozzle can be used for this
purpose. Excessive airflow should also be avoided since this may cause shifting of
adjacent components. Once the joints have reflowed, the vacuum lift-off can start.
Because of their small size the vacuum pressure should be kept below 15 inch of Hg. This
will prevent damage to the PCB solder land (‘pad lift’). The temperature of the package
should not exceed 250 C during this rework process since damage can occur to either
the package or the PCB. The temperature profile depends on the customer application.
Parameter
Average ramp-up rate [T
Preheat
Time maintained above
Maximum peak temperature (T
Time within 5 C of actual peak
temperature (T
Ramp-down rate
Minimum peak temperature [T
Time 25 C to T
1. Component removal
2. Site redresss
3. Solder paste application
4. Repair: component placement and attachment
•
•
•
•
•
Ramp-up and ramp-down is lower than specified in JEDEC J-STD-020C.
Temperature min [T
Temperature max [T
Time t
Temperature (T
Time (t
S
Recommended reflow profile data
L
)
[T
S(min)
P
P
)
L
to T
)
S(min)
S(max)
S(max)
S(max)
Rev. 01 — 18 July 2007
]
]
P(min)
]
to T
P
)
P
] 205 C
] 3 C/s maximum
Eutectic Sn/Pb
100 C
150 C
60 s to 120 s
183 C
60 s to 90 s
240 C (+0 C to 5 C)
10 s to 30 s
> 180 C: 2 C/s maximum
< 180 C: 6 C/s maximum
4 min to 5 min
IEEE 802.11b System-in-Package
Pb-free
2 C/s maximum
150 C
200 C
75 s to 90 s ( 0.75 C/s)
217 C
70 s to 90 s
240 C to (250 + 0) C
20 s to 30 s
> 180 C: 2 C/s maximum
< 180 C: 6 C/s maximum
230 C
4 min to 5 min
BGW200EG
© NXP B.V. 2007. All rights reserved.
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