BGW200EG/01,518 NXP Semiconductors, BGW200EG/01,518 Datasheet - Page 60
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
BGW200EG/01,518
Manufacturer Part Number
BGW200EG/01,518
Description
IC WLAN SIP MOD 802.11B 68HVQFN
Manufacturer
NXP Semiconductors
Series
BGW200r
Datasheet
1.BGW200EG01515.pdf
(76 pages)
Specifications of BGW200EG/01,518
Frequency
2.4GHz ~ 2.5GHz
Modulation Or Protocol
DBPSK, DQPSK, CCK
Applications
PDA's, Portable Audio/Video, Smartphones
Power - Output
8dBm ~ 18dBm
Data Interface
PCB, Surface Mount
Antenna Connector
PCB, Surface Mount
Package / Case
68-VQFN Exposed Pad, 68-HVQFN, 68-SQFN, 68-DHVQFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Supply
-
Operating Temperature
-
Sensitivity
-
Memory Size
-
Data Rate - Maximum
-
Current - Transmitting
-
Current - Receiving
-
Other names
935279198518
BGW200EG/01-T
BGW200EG/01-T
BGW200EG/01-T
BGW200EG/01-T
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NXP Semiconductors
BGW200EG_1
Product data sheet
Fig 33. SPI1 master timing (CPHA = 0)
Fig 34. SPI1 master timing (CPHA = 1)
(CPOL = 0)
(CPOL = 1)
(CPOL = 0)
(CPOL = 1)
SPI_SS_N
SPI_MOSI
SPI_MISO
SPI_SS_N
SPI_MOSI
SPI_MISO
SPI_SCK
SPI_SCK
SPI_SCK
SPI_SCK
(output)
(output)
(input)
(input)
t
d(o)(SPI_MOSI)
Rev. 01 — 18 July 2007
t
su(SPI_MISO)
t
d(o)(SPI_MOSI)
t
su(SPI_MISO)
T
T
SPI_SCK
SPI_SCK
IEEE 802.11b System-in-Package
t
clk(L)
t
t
h(i)(SPI_MISO)
h(o)(SPI_MOSI)
t
clk(H)
BGW200EG
t
t
h(i)(SPI_MISO)
h(o)(SPI_MOSI)
© NXP B.V. 2007. All rights reserved.
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