BGW200EG/01,518 NXP Semiconductors, BGW200EG/01,518 Datasheet - Page 9

• Manufacturer Part Number: BGW200EG/01,518
• Description: IC WLAN SIP MOD 802.11B 68HVQFN
• Manufacturer: NXP Semiconductors
• Series: BGW200r

Specifications of BGW200EG/01,518

• Frequency: 2.4GHz ~ 2.5GHz
• Modulation Or Protocol: DBPSK, DQPSK, CCK
• Applications: PDA's, Portable Audio/Video, Smartphones
• Power - Output: 8dBm ~ 18dBm
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Package / Case: 68-VQFN Exposed Pad, 68-HVQFN, 68-SQFN, 68-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Current - Transmitting: -
• Current - Receiving: -
• Other names: 935279198518; BGW200EG/01-T; BGW200EG/01-T

NXP Semiconductors
7. Functional description
BGW200EG_1
Product data sheet
7.1 General
The BGW200EG contains the following parts in one SiP (with embedded software):
Together with a reference clock and antenna with harmonic filter, this device forms a
complete WLAN solution. The system architecture is ideal for mobile products and
requires no load on the host processor. The host sleeps while the WLAN listens for the
beacon and is woken by the WLAN when appropriate.
The BGW200EG is designed to be used for wireless links operating in the globally
available ISM band, between 2402 MHz and 2497 MHz. The radio part is composed of a
fully integrated, state-of-the-art, direct conversion transceiver chip, a linear power
amplifier chip, an RX antenna filter for out-of-band blocking, TX/RX and antenna diversity
switches, TX and RX baluns and a basic amount of supply decoupling. The SiP radio
circuit is integrated on an organic substrate. The total WLAN system is integrated in a
10 mm
component. The device is a ‘plug-and-play’ SiP. Robust design requires no manufacturing
trimming, resulting in a cost-optimized solution. The RF antenna ports have a normalized
50
transmission line.
The BGW200EG supports two host interfaces. The high-speed SPI slave (SPI2) interface
is ideal for embedded applications since only 5 signal lines are required to connect to the
host controller, and the protocol for this interface has a low processing overhead. The
SDIO interface can operate in SPI, SD1 and SD4 modes, and can be used in an
embedded application or in a secure digital NIC card. The ARM7TDMI-S RISC core, today
considered as the standard RISC processor in the telecommunications industry, is
integrated in the SA2443A. The processor is characterized by its extremely low mW/MIPS
ratio. The BGW200EG has 1 Mbit of on-chip SRAM, thereby eliminating the need for
external SRAM. This reduces the total footprint of the WLAN solution as well as the power
consumption of the system. The functionality of the IEEE 802.11 MAC is split between
hardware and software running on the ARM microcontroller. The IEEE 802.11b modem is
implemented in hardware with control and configuration handled by software.
The BGW200EG is designed to be used as a low-cost, low-power wireless LAN link.
Existing WLAN solutions, aimed at the computing market, have made use of the host
processor to implement such functions as fragmentation and defragmentation. The
BGW200EG implements all WLAN functions internally (implemented in either hardware or
firmware) with the result that there is no processing load on the host controller. This link
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IEEE 802.11b RF transceiver
IEEE 802.11b compliant modem
IEEE 802.11b MAC
ARM7TDMI-S microcontroller
Static RAM (SRAM)
Interface circuits
Power management circuit
impedance and each can be connected directly to an external antenna with a 50
15 mm HLLGA68 package and can be handled as a standard pick-and-place
Rev. 01 — 18 July 2007
IEEE 802.11b System-in-Package
BGW200EG
© NXP B.V. 2007. All rights reserved.
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