BGW200EG/01,518 NXP Semiconductors, BGW200EG/01,518 Datasheet - Page 66

• Manufacturer Part Number: BGW200EG/01,518
• Description: IC WLAN SIP MOD 802.11B 68HVQFN
• Manufacturer: NXP Semiconductors
• Series: BGW200r

Specifications of BGW200EG/01,518

• Frequency: 2.4GHz ~ 2.5GHz
• Modulation Or Protocol: DBPSK, DQPSK, CCK
• Applications: PDA's, Portable Audio/Video, Smartphones
• Power - Output: 8dBm ~ 18dBm
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Package / Case: 68-VQFN Exposed Pad, 68-HVQFN, 68-SQFN, 68-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Current - Transmitting: -
• Current - Receiving: -
• Other names: 935279198518; BGW200EG/01-T; BGW200EG/01-T

NXP Semiconductors
16. Soldering
BGW200EG_1
Product data sheet
Fig 41. PCB footprint outline
Reflow soldering footprint for SOT858-1; non solder mask defined; copper defined
13.30
16.1.1 PCB footprint layout
solder lands
solder paste
solder resist
occupied area
16.1 Printed-circuit board
13.00
4.10
0.35
1.80
1.65
0.65
Rev. 01 — 18 July 2007
3.80
0.60
10.50
8.00
8.10
0.40
stencil thickness:
0.1 - 0.125 mm
0.30
Detail:
IEEE 802.11b System-in-Package
BGW200EG
0.40
0.30
0.55
0.35
15.50
© NXP B.V. 2007. All rights reserved.
0.05
0.65
0.75
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