BGW200EG/01,518 NXP Semiconductors, BGW200EG/01,518 Datasheet - Page 76

• Manufacturer Part Number: BGW200EG/01,518
• Description: IC WLAN SIP MOD 802.11B 68HVQFN
• Manufacturer: NXP Semiconductors
• Series: BGW200r

Specifications of BGW200EG/01,518

• Frequency: 2.4GHz ~ 2.5GHz
• Modulation Or Protocol: DBPSK, DQPSK, CCK
• Applications: PDA's, Portable Audio/Video, Smartphones
• Power - Output: 8dBm ~ 18dBm
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Package / Case: 68-VQFN Exposed Pad, 68-HVQFN, 68-SQFN, 68-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Current - Transmitting: -
• Current - Receiving: -
• Other names: 935279198518; BGW200EG/01-T; BGW200EG/01-T

NXP Semiconductors
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Contact information. . . . . . . . . . . . . . . . . . . . . 74
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
IEEE 802.11b System-in-Package
BGW200EG
Document identifier: BGW200EG_1
Date of release: 18 July 2007
All rights reserved.