BGW200EG/01,518 NXP Semiconductors, BGW200EG/01,518 Datasheet - Page 54

• Manufacturer Part Number: BGW200EG/01,518
• Description: IC WLAN SIP MOD 802.11B 68HVQFN
• Manufacturer: NXP Semiconductors
• Series: BGW200r

Specifications of BGW200EG/01,518

• Frequency: 2.4GHz ~ 2.5GHz
• Modulation Or Protocol: DBPSK, DQPSK, CCK
• Applications: PDA's, Portable Audio/Video, Smartphones
• Power - Output: 8dBm ~ 18dBm
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Package / Case: 68-VQFN Exposed Pad, 68-HVQFN, 68-SQFN, 68-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Current - Transmitting: -
• Current - Receiving: -
• Other names: 935279198518; BGW200EG/01-T; BGW200EG/01-T

NXP Semiconductors
BGW200EG_1
Product data sheet
Fig 24. Receiver sensitivity as a function of temperature
(dBm)
(dBm)
S
S
(1) V
(2) V
(3) V
RX
RX
a. 1 Mbit/s packets in channel 1
c. 11 Mbit/s packets in channel 1
88
89
90
91
92
93
80
81
82
83
84
85
40
40
DD
DD
DD
= 2.7 V
= 2.85 V
= 3.0 V
10
10
60
60
T
T
amb
amb
001aad209
001aad211
(1)
(2)
(3)
( C)
(3)
(2)
(1)
( C)
110
110
Rev. 01 — 18 July 2007
(dBm)
(dBm)
S
S
RX
RX
b. 1 Mbit/s packets in channel 14
d. 11 Mbit/s packets in channel 14
88
89
90
91
92
93
80
81
82
83
84
85
40
40
(1)
(3)
(2)
IEEE 802.11b System-in-Package
10
10
BGW200EG
60
60
T
T
© NXP B.V. 2007. All rights reserved.
amb
amb
001aad210
001aad212
(3)
(2)
(1)
( C)
( C)
110
110
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