PIC18F6722-E/PT Microchip Technology, PIC18F6722-E/PT Datasheet - Page 6

• Manufacturer Part Number: PIC18F6722-E/PT
• Description: IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,TQFP,64PIN,PLASTIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F6722-E/PT

• Rohs Compliant: YES
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 54
• Program Memory Size: 128KB (64K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 3.8K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 64-TFQFP
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3936 B
• Interface Type: SPI, I2C, EUSART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 54
• Number Of Timers: 5
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183032, DM183022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 12 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MA180020 - MODULE PLUG-IN HPC EXPL 18F87J11
• Lead Free Status / Rohs Status: Details

PIC18F8722 FAMILY
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Interrupts .................................................................................................................................................................................. 119
11.0 I/O Ports ................................................................................................................................................................................... 135
12.0 Timer0 Module ......................................................................................................................................................................... 161
13.0 Timer1 Module ......................................................................................................................................................................... 165
14.0 Timer2 Module ......................................................................................................................................................................... 171
15.0 Timer3 Module ......................................................................................................................................................................... 173
16.0 Timer4 Module ......................................................................................................................................................................... 177
17.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 179
18.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 187
19.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 205
20.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART) ....................................................................................... 247
21.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 271
22.0 Comparator Module.................................................................................................................................................................. 281
23.0 Comparator Voltage Reference Module ................................................................................................................................... 287
24.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 291
25.0 Special Features of the CPU .................................................................................................................................................... 297
26.0 Instruction Set Summary .......................................................................................................................................................... 321
27.0 Development Support............................................................................................................................................................... 371
28.0 Electrical Characteristics .......................................................................................................................................................... 375
29.0 Packaging Information.............................................................................................................................................................. 419
Appendix A: Revision History............................................................................................................................................................. 425
Appendix B: Device Differences......................................................................................................................................................... 425
Appendix C: Conversion Considerations ........................................................................................................................................... 426
Appendix D: Migration From Baseline to Enhanced Devices............................................................................................................. 426
Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 427
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 427
Index .................................................................................................................................................................................................. 429
The Microchip Web Site ..................................................................................................................................................................... 441
Customer Change Notification Service .............................................................................................................................................. 441
Customer Support .............................................................................................................................................................................. 441
Reader Response .............................................................................................................................................................................. 442
PIC18F8722 Family Product Identification System............................................................................................................................ 443
DS39646C-page 4
Device Overview .......................................................................................................................................................................... 7
Oscillator Configurations ............................................................................................................................................................ 31
Power-Managed Modes ............................................................................................................................................................. 41
Reset .......................................................................................................................................................................................... 49
Memory Organization ................................................................................................................................................................. 63
Flash Program Memory .............................................................................................................................................................. 87
External Memory Bus ................................................................................................................................................................. 97
Data EEPROM Memory ........................................................................................................................................................... 111
8 x 8 Hardware Multiplier.......................................................................................................................................................... 117
© 2008 Microchip Technology Inc.