MT44K16M36 MICRON [Micron Technology], MT44K16M36 Datasheet - Page 48

• Manufacturer Part Number: MT44K16M36
• Description: 576Mb: x18, x36 RLDRAM 3
• Manufacturer: MICRON [Micron Technology]

Temperature and Thermal Impedance Characteristics
Table 28: Temperature Limits
Table 29: Thermal Impedance
PDF: 09005aef84003617
576mb_rldram3.pdf – Rev. B 1/12 EN
Parameter
Storage temperature
Reliability junction temperature
Operating junction temperature
Operating case temperature
Package Substrate
FBGA
2-layer
4-layer
Notes:
Note:
Airflow = 0m/s
θ JA (°C/W)
It is imperative that the device’s temperature specifications be maintained in order to
ensure that the junction temperature is in the proper operating range to meet data
sheet specifications. An important way to maintain the proper junction temperature is
to use the device’s thermal impedances correctly. Thermal impedances are listed for the
available packages.
Incorrectly using thermal impedances can produce significant errors. Read Micron
technical note TN-00-08, “Thermal Applications” prior to using thermal impedances
listed below.
The device’s safe junction temperature range can be maintained when the T
tion is not exceeded. In applications where the device’s ambient temperature is too
high, use of forced air and/or heat sinks may be required in order to meet the case tem-
perature specifications.
1. MAX storage case temperature; T
2. Temperatures greater than 110°C may cause permanent damage to the device. This is a
3. Junction temperature depends upon package type, cycle time, loading, ambient temper-
4. MAX operating case temperature; T
5. Device functionality is not guaranteed if the device exceeds maximum T
1. Thermal impedance data is based on a number of samples from multiple lots, and
39.3
22.0
ure 21 (page 49)). This case temperature limit is allowed to be exceeded briefly during
package reflow, as noted in Micron technical note TN-00-15.
stress rating only and functional operation of the device at or above this is not implied.
Exposure to absolute maximum rating conditions for extended periods may adversely
affect the reliability of the part.
ature, and airflow.
ure 21 (page 49)).
tion.
should be viewed as a typical number.
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
Temperature and Thermal Impedance Characteristics
Airflow = 1m/s
θ JA (°C/W)
28.8
17.2
Symbol
T
T
T
J(REL)
J(OP)
T
STG
C
48
STG
Airflow = 2m/s
C
Micron Technology, Inc. reserves the right to change products or specifications without notice.
is measured in the center of the package (see Fig-
θ JA (°C/W)
is measured in the center of the package (see Fig-
Min
-55
-40
-40
0
0
25.2
15.9
-
-
576Mb: x18, x36 RLDRAM 3
Max
150
110
110
100
100
95
95
θ JB (°C/W)
16.3
10.3
© 2011 Micron Technology, Inc. All rights reserved.
Units
°C
°C
°C
°C
°C
°C
°C
C
during opera-
θ JC (°C/W)
C
specifica-
2.0
Notes
4, 5
4, 5
1
2
2
3
3