MT44K16M36 MICRON [Micron Technology], MT44K16M36 Datasheet - Page 12

• Manufacturer Part Number: MT44K16M36
• Description: 576Mb: x18, x36 RLDRAM 3
• Manufacturer: MICRON [Micron Technology]

Ball Assignments and Descriptions
Table 1: 32 Meg x 18 Ball Assignments – 168-Ball FBGA (Top View)
PDF: 09005aef84003617
576mb_rldram3.pdf – Rev. B 1/12 EN
M
A
D
G
H
K
N
B
C
E
F
L
J
V
V
V
V
A11
A19
V
V
V
V
A7
NF
DDQ
1
EXT
EXT
DD
DD
SS
SS
SS
NF
V
V
A15
TCK
V
V
V
V
A0
NF
NF
NF
(A20)
2
SSQ
SSQ
DD
SS
SS
SS
Notes:
1
V
V
V
V
A14
V
V
V
A6
NF
NF
NF
NF
DDQ
DDQ
SSQ
SSQ
3
DD
DD
DD
1. Location of the additional address signal (A20) required on the 1Gb RLDRAM 3 x18 con-
2. NF balls for the x18 configuration are internally connected and have parasitic character-
3. MF is assumed to be tied LOW for this ball assignment.
figuration. Internally connected so it can mirror the A5 address signal when MF is asser-
ted HIGH. Has parasitic characteristics of an address pin.
istics of an I/O. Balls may be connected to V
V
V
V
V
TDO
A16
V
NF
NF
NF
A2
NF
NF
DDQ
DDQ
SSQ
SSQ
4
SS
V
V
V
V
V
V
BA1
V
NF
NF
A1
NF
NF
DDQ
DDQ
DDQ
DDQ
SSQ
SSQ
5
DD
V
V
WE#
V
BA3
V
V
NF
NF
NF
NF
NF
NF
DDQ
DDQ
6
SSQ
SSQ
SS
12
DK0#
DK1#
DM0
DM1
V
DK0
DK1
V
CK#
MF
V
ZQ
CK
7
REF
REF
SS
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Ball Assignments and Descriptions
DQ12
DQ17
QK0#
QK1#
V
V
REF#
DQ7
DQ2
V
V
BA2
V
DDQ
DDQ
8
SSQ
SSQ
SS
SSQ
.
DQ15
V
V
V
V
DQ5
V
QK0
QK1
V
BA0
V
A3
DDQ
DDQ
DDQ
DDQ
576Mb: x18, x36 RLDRAM 3
SSQ
SSQ
9
DD
DQ13
V
V
DQ8
V
DQ3
DQ1
DQ9
V
A17
TDI
V
10
A4
DDQ
DDQ
SSQ
SSQ
SS
© 2011 Micron Technology, Inc. All rights reserved.
DQ10
DQ16
V
V
DQ6
DQ0
V
V
V
V
A12
V
11
A8
DDQ
DDQ
SSQ
SSQ
DD
DD
DD
QVLD
DQ14
DQ4
V
V
TMS
A18
CS#
V
V
V
V
A5
12
SSQ
SSQ
DD
SS
SS
SS
RESET#
DQ11
V
V
V
A13
A10
V
V
V
V
V
A9
13
DDQ
EXT
EXT
DD
DD
SS
SS
SS