MT44K16M36 MICRON [Micron Technology], MT44K16M36 Datasheet - Page 7

• Manufacturer Part Number: MT44K16M36
• Description: 576Mb: x18, x36 RLDRAM 3
• Manufacturer: MICRON [Micron Technology]

List of Tables
Table 1: 32 Meg x 18 Ball Assignments – 168-Ball FBGA (Top View) .................................................................. 12
Table 2: 16 Meg x 36 Ball Assignments – 168-Ball FBGA (Top View) .................................................................. 13
Table 3: Ball Descriptions .............................................................................................................................. 14
Table 4: I
Table 5: Absolute Maximum Ratings .............................................................................................................. 21
Table 6: Input/Output Capacitance ................................................................................................................ 21
Table 7: DC Electrical Characteristics and Operating Conditions ..................................................................... 22
Table 8: Input AC Logic Levels ........................................................................................................................ 22
Table 9: Control and Address Balls ................................................................................................................. 24
Table 10: Clock, Data, Strobe, and Mask Balls ................................................................................................. 24
Table 11: Differential Input Operating Conditions (CK, CK# and DKx, DKx#) ................................................... 25
Table 12: Allowed Time Before Ringback (
Table 13: Single-Ended Input Slew Rate Definition .......................................................................................... 27
Table 14: Differential Input Slew Rate Definition ............................................................................................. 29
Table 15: ODT DC Electrical Characteristics ................................................................................................... 30
Table 16: R
Table 17: ODT Sensitivity Definition .............................................................................................................. 32
Table 18: ODT Temperature and Voltage Sensitivity ........................................................................................ 32
Table 19: Driver Pull-Up and Pull-Down Impedance Calculations ................................................................... 34
Table 20: Output Driver Sensitivity Definition ................................................................................................. 35
Table 21: Output Driver Voltage and Temperature Sensitivity .......................................................................... 35
Table 22: Single-Ended Output Driver Characteristics ..................................................................................... 36
Table 23: Differential Output Driver Characteristics ........................................................................................ 37
Table 24: Single-Ended Output Slew Rate Definition ....................................................................................... 40
Table 25: Differential Output Slew Rate Definition .......................................................................................... 41
Table 26: RL3 Speed Bins ............................................................................................................................... 42
Table 27: AC Electrical Characteristics ............................................................................................................ 43
Table 28: Temperature Limits ......................................................................................................................... 48
Table 29: Thermal Impedance ........................................................................................................................ 48
Table 30: Command and Address Setup and Hold Values Referenced at 1 V/ns – AC/DC-Based ........................ 50
Table 31: Derating Values for
Table 32: Minimum Required Time
Table 33: Data Setup and Hold Values at 1 V/ns (DKx, DKx# at 2V/ns) – AC/DC-Based ..................................... 56
Table 34: Derating Values for
Table 35: Minimum Required Time
Table 36: Command Descriptions .................................................................................................................. 62
Table 37: Command Table ............................................................................................................................. 62
Table 38:
Table 39: Address Widths of Different Burst Lengths ....................................................................................... 70
Table 40: Address Mapping in Multiplexed Address Mode ............................................................................... 96
Table 41: 32 Meg x 18 Ball Assignments with MF Ball Tied HIGH ..................................................................... 101
Table 42: TAP Input AC Logic Levels .............................................................................................................. 108
Table 43: TAP AC Electrical Characteristics .................................................................................................... 108
Table 44: TAP DC Electrical Characteristics and Operating Conditions ............................................................ 109
Table 45: Identification Register Definitions .................................................................................................. 109
Table 46: Scan Register Sizes ......................................................................................................................... 110
Table 47: Instruction Codes .......................................................................................................................... 110
Table 48: Boundary Scan (Exit) ..................................................................................................................... 110
PDF: 09005aef84003617
576mb_rldram3.pdf – Rev. B 1/12 EN
DD
t
RC_MRS MR0[3:0] values ................................................................................................................ 65
TT
Operating Conditions and Maximum Limits ................................................................................ 17
Effective Impedances ................................................................................................................ 31
t
t
IS/
DS/
t
IH – AC150/DC100-Based ............................................................................ 51
t
DH – AC150/DC100-Based ......................................................................... 57
t
t
VAC Above V
VAC Above V
t
DVAC) for CK, CK#, DKx, and DKx# ................................................. 27
IH(AC)
IH(AC)
(or Below V
(or Below V
7
Micron Technology, Inc. reserves the right to change products or specifications without notice.
IL(AC)
IL(AC)
) for Valid Transition ............................ 51
) for Valid Transition ............................ 57
576Mb: x18, x36 RLDRAM 3
© 2011 Micron Technology, Inc. All rights reserved.
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