OR3T125 Agere Systems, OR3T125 Datasheet - Page 153

• Manufacturer Part Number: OR3T125
• Description: 3C and 3T Field-Programmable Gate Arrays
• Manufacturer: Agere Systems

Data Sheet
June 1999
Lucent Technologies Inc.
Pin Information
Package Compatibility
Table 68 provides the number of user I/Os available for the ORCA Series 3 FPGAs for each available package.
Each package has six dedicated configuration pins.
Tables 70—75 provide the package pin and pin function for the ORCA Series 3 FPGAs and packages. The bond
pad name is identified in the PIC nomenclature used in the ORCA Foundry design editor.
When the number of FPGA bond pads exceeds the number of package pins, bond pads are unused. When the
number of package pins exceeds the number of bond pads, package pins are left unconnected (no connects).
When a package pin is to be left as a no connect for a specific die, it is indicated as a note in the device pad column
for the FPGA. The tables provide no information on unused pads.
Table 68. ORCA I/Os Summary
*User I/O count includes four ExpressCLK inputs.
OR3T20
User I/Os*
V
Configuration
Unused
OR3T30
User I/Os*
V
Configuration
Unused
OR3C/T55
User I/Os*
V
Configuration
Unused
OR3C/T80
User I/Os*
V
Configuration
Unused
OR3T125
User I/Os*
V
Configuration
Unused
DD
DD
DD
DD
DD
/V
/V
/V
/V
/V
SS
SS
SS
SS
SS
Device
(continued)
SQFP/SQPF2
208-Pin
171
171
171
171
171
31
31
31
31
31
6
0
6
0
6
0
6
0
6
0
SQFP/SQFP2
240-Pin
192
192
192
192
192
40
40
42
42
42
6
2
6
2
6
0
6
0
6
0
256-Pin
PBGA
192
221
223
26
32
26
26
—
—
—
—
—
—
—
—
6
6
3
6
1
352-Pin
ORCA Series 3C and 3T FPGAs
PBGA
192
106
224
288
298
298
48
48
74
48
10
48
48
6
6
6
6
0
6
0
432-Pin
EBGA
342
342
—
—
—
—
—
—
—
—
—
84
84
—
—
—
6
0
6
0
600-Pin
EBGA
448
140
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
6
6
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