OR3T125 Agere Systems, OR3T125 Datasheet - Page 201

• Manufacturer Part Number: OR3T125
• Description: 3C and 3T Field-Programmable Gate Arrays
• Manufacturer: Agere Systems

Data Sheet
June 1999
Lucent Technologies Inc.
Package Outline Diagrams
240-Pin SQFP2
Dimensions are in millimeters.
60
1
240
61
0.50 TYP
DETAIL A
EXPOSED HEAT SINK APPEARS ON BOTTOM
SURFACE: CHIP BONDED FACE UP. (SEE DETAIL C.)
PIN #1 IDENTI FIER ZONE
DETAIL C (SQFP2 CHIP-UP)
34.60
32.00
CHIP
24. 2 REF
0.20
0.20
DETAIL B
(continued)
CHIP BONDED FACE UP
COPPER HEAT SINK
0.25 MIN
181
120
180
121
3.40
24.2
REF
0.20
32.00
4.10 MAX
0.20
ORCA Series 3C and 3T FPGAs
34.60
0.20
SEATING PLANE
SEATING PLANE
0.08
GAGE PLANE
0.17/0.27
1.30 REF
0.25
DETAIL B
DETAIL A
0.10
0.090/0.200
M
0.50/0.75
5-3825(F).a
201