OR3T125 Agere Systems, OR3T125 Datasheet - Page 199

• Manufacturer Part Number: OR3T125
• Description: 3C and 3T Field-Programmable Gate Arrays
• Manufacturer: Agere Systems

Data Sheet
June 1999
Lucent Technologies Inc.
Package Outline Diagrams
208-Pin SQFP2
Dimensions are in millimeters.
208
53
0.50 TYP
DETAIL A
EXPOSED HEAT SINK APPEARS ON BOTTOM
SURFACE: CHIP BONDED FACE UP. (SEE DETAIL C.)
PIN #1 IDENTIFIER ZONE
DETAIL C (SQFP2 CHIP-UP)
30.60
28.00
21.0 REF
CHIP
0.20
0.20
DETAIL B
CHIP BONDED FACE UP
COPPER HEAT SINK
(continued)
0.25 MIN
157
104
156
105
3.40
21.0
REF
0.20
4.10 MAX
28.00
0.20
30.60
0.20
SEATING PLANE
ORCA Series 3C and 3T FPGAs
0.08
SEATING PLANE
GAGE PLANE
0.17/0.2
1.30 REF
0.25
DETAIL B
DETAIL A
0.10
0.090/0.200
5-3828(F)
0.50/0.75
M
5-3828(F).a
199