OR3T125 Agere Systems, OR3T125 Datasheet - Page 57

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OR3T125

Manufacturer Part Number
OR3T125
Description
3C and 3T Field-Programmable Gate Arrays
Manufacturer
Agere Systems
Datasheet

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Data Sheet
June 1999
Special Function Blocks
Boundary Scan
The increasing complexity of integrated circuits (ICs)
and IC packages has increased the difficulty of testing
printed-circuit boards (PCBs). To address this testing
problem, the IEEE standard 1149.1/D1 ( IEEE Standard
Test Access Port and Boundary-Scan Architecture) is
implemented in the ORCA series of FPGAs. It allows
users to efficiently test the interconnection between
integrated circuits on a PCB as well as test the inte-
grated circuit itself. The IEEE 1149.1/D1 standard is a
well-defined protocol that ensures interoperability
among boundary-scan (BSCAN) equipped devices
from different vendors.
The IEEE 1149.1/D1 standard defines a test access
port (TAP) that consists of a four-pin interface with an
optional reset pin for boundary-scan testing of inte-
grated circuits in a system. The ORCA Series FPGA
provides four interface pins: test data in (TDI), test
mode select (TMS), test clock (TCK), and test data out
(TDO). The
also resets the boundary-scan logic.
The user test host serially loads test commands and
test data into the FPGA through these pins to drive out-
puts and examine inputs. In the configuration shown in
Figure 36, where boundary scan is used to test ICs,
test data is transmitted serially into TDI of the first
BSCAN device (U1), through TDO/TDI connections
between BSCAN devices (U2 and U3), and out TDO of
the last BSCAN device (U4). In this configuration, the
TMS and TCK signals are routed to all boundary-scan
ICs in parallel so that all boundary-scan components
operate in the same state. In other configurations, mul-
tiple scan paths are used instead of a single ring. When
multiple scan paths are used, each ring is indepen-
dently controlled by its own TMS and TCK signals.
Figure 37 provides a system interface for components
used in the boundary-scan testing of PCBs. The three
major components shown are the test host, boundary-
scan support circuit, and the devices under test
(DUTs). The DUTs shown here are ORCA Series
FPGAs with dedicated boundary-scan circuitry. The
test host is normally one of the following: automatic test
equipment (ATE), a workstation, a PC, or a micropro-
cessor.
Lucent Technologies Inc.
PRGM
pin used to reconfigure the device
(continued)
Key: BSC = boundary-scan cell, BDC = bidirectional data cell,
Figure 36. Printed-Circuit Board with Boundary-
PL[ij]
and DCC = data control cell.
TMS
TCK
TDO
TMS
TCK
TDO
SCAN
SCAN
OUT
DCC
BDC
BSC
TDO TCK TMS TDI
IN
TDI
TDI
INSTRUCTION
U2
U3
Scan Circuitry
REGISTER
REGISTER
BYPASS
TAPC
p_ts
p_out
p_in
ORCA Series 3C and 3T FPGAs
SCAN
OUT
SEE ENLARGED VIEW BELOW
net a
net b
net c
p_ts
BSC
DCC
ARRAY
PLC
SCAN
p_out
IN
s
BDC
p_in
PT[ij]
PB[ij]
TMS
TCK
TDO
TMS
TCK
TDO
BSC
p_in
BDC DCC
SCAN
IN
TDI
TDI
p_out
p_out
U2
U4
p_in
p_ts
p_ts
SCAN
SCAN
BDC
DCC
SCAN
OUT
BSC
OUT
IN
PR[ij]
5-5972(F)
TDI
TMS
TCK
TDO
57

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