OR3T125 Agere Systems, OR3T125 Datasheet - Page 203

• Manufacturer Part Number: OR3T125
• Description: 3C and 3T Field-Programmable Gate Arrays
• Manufacturer: Agere Systems

Data Sheet
June 1999
Lucent Technologies Inc.
Package Outline Diagrams
352-Pin PBGA
Dimensions are in millimeters.
Note: Although the 36 thermal enhancement balls are stated as an option, they are standard on the 352 FPGA package.
(SEE NOTE BELOW)
IDENTIFIER ZONE
CENTER ARRAY
ENHANCEMENT
FOR THERMAL
(OPTIONAL)
COMPOUND
CORNER
A1 BALL
A1 BALL
MOLD
PWB
0.60
0.56
AF
AE
AD
AC
AB
AA
W
M
G
Y
V
U
T
R
P
N
K
H
F
E
D
C
B
A
L
J
0.10
1 2 3 4 5 6 7 8 9 10
(continued)
0.06
25 SPACES @ 1.27 = 31.75
35.00
30.00
11 13
12
14 16
+0.70
–0.00
15
0.20
17
SOLDER BALL
18
19
20
21
22
23
1.17
24
25
ORCA Series 3C and 3T FPGAs
26
0.05
30.00
0.75
@ 1.27 = 31.75
+0.70
–0.00
25 SPACES
0.15
2.33
SEATING PLANE
35.00
0.20
0.21
0.20
5-4407(F)
203