MCIMX35WPDKJ Freescale Semiconductor, MCIMX35WPDKJ Datasheet - Page 20
![BOARD DEV FOR I.MX35](/photos/37/58/375859/imx35_bd_sml.jpg)
MCIMX35WPDKJ
Manufacturer Part Number
MCIMX35WPDKJ
Description
BOARD DEV FOR I.MX35
Manufacturer
Freescale Semiconductor
Series
i.MX35r
Type
MPUr
Datasheets
1.MCIMX35WPDKJ.pdf
(148 pages)
2.MCIMX35WPDKJ.pdf
(2 pages)
3.MCIMX35WPDKJ.pdf
(10 pages)
Specifications of MCIMX35WPDKJ
Contents
Module and Misc Hardware
Processor To Be Evaluated
i.MX35
Processor Series
i.MX35
Data Bus Width
32 bit
Interface Type
RS-232, Ethernet, USB, CAN, JTAG
Core
ARM11
For Use With/related Products
i.MX35
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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1
2
3
4
4.7
I/O pins are of two types: GPIO and DDR. DDR pins can be configured in three different drive strength
modes: mobile DDR, SDRAM, and DDR2. The SDRAM and mobile DDR modes can be further
customized at three drive strength levels: normal, high, and max.
Table 13
20
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Junction to boards
Junction to case (top)
Junction to package top
Mobile DDR (1.8 V)
SDRAM (1.8 V)
SDRAM (3.3 V)
DDR2 (1.8 V)
Junction-to-ambient thermal resistance determined per JEDC JESD51-3 and JESD51-6. Thermal test board meets JEDEC
specification for this package.
Junction-to-board thermal resistance determined per JEDC JESD51-8. Thermal test board meets JEDEC specification for this
package.
Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used
for the case temperature. Reported value includes the thermal resistance of the interface layer.
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, this thermal characterization parameter is written
as Psi-JT.
Drive Mode
shows currents for the different DDR pin drive strength modes.
I/O Pin DC Electrical Characteristics
2
1
1
1
1
i.MX35 Applications Processors for Industrial and Consumer Products, Rev. 9
natural convection
natural convection
(at 200 ft/min)
(at 200 ft/min)
3
4
Rating
Table 13. DDR Pin Drive Strength Mode Current Levels
Table 12. Thermal Resistance Data
Normal
3.6 mA
4 mA
—
—
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
Condition
—
—
7.2 mA
High
8 mA
—
—
Symbol
R
R
R
R
R
R
eJCtop
Ψ
eJMA
eJMA
eJA
eJA
eJB
JT
Freescale Semiconductor
10.8 mA
13.4 mA
6.5 mA
12 mA
Max.
Value
53
30
44
27
19
10
2
ºC/W
ºC/W
ºC/W
ºC/W
ºC/W
ºC/W
ºC/W
Unit
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