MCIMX35WPDKJ Freescale Semiconductor, MCIMX35WPDKJ Datasheet - Page 46
![BOARD DEV FOR I.MX35](/photos/37/58/375859/imx35_bd_sml.jpg)
MCIMX35WPDKJ
Manufacturer Part Number
MCIMX35WPDKJ
Description
BOARD DEV FOR I.MX35
Manufacturer
Freescale Semiconductor
Series
i.MX35r
Type
MPUr
Datasheets
1.MCIMX35WPDKJ.pdf
(148 pages)
2.MCIMX35WPDKJ.pdf
(2 pages)
3.MCIMX35WPDKJ.pdf
(10 pages)
Specifications of MCIMX35WPDKJ
Contents
Module and Misc Hardware
Processor To Be Evaluated
i.MX35
Processor Series
i.MX35
Data Bus Width
32 bit
Interface Type
RS-232, Ethernet, USB, CAN, JTAG
Core
ARM11
For Use With/related Products
i.MX35
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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Timing parameters are relevant only to SDR SDRAM. For the specific DDR SDRAM data related timing parameters, see
Table 41
SD10
SD7
SD8
SD9
ID
and
Address hold time
SDRAM access time
Data out hold time
Active to read/write command period
Table
SDR SDRAM CLK parameters are measured from the 50% point—that is,
high is defined as 50% of signal value and low is defined as 50% of signal
value. SD1 + SD2 does not exceed 7.5 ns for 133 MHz.
The timing parameters are similar to the ones used in SDRAM data
sheets—that is,
are driven by the ESDCTL at the negative edge of SDCLK and the
parameters are measured at maximum memory frequency.
Table 33. DDR/SDR SDRAM Read Cycle Timing Parameters (continued)
i.MX35 Applications Processors for Industrial and Consumer Products, Rev. 9
42.
1
Table 33
Parameter
indicates SDRAM requirements. All output signals
NOTE
Symbol
tOH
tRC
tAH
tAC
Min.
1.8
1.2
10
—
Freescale Semiconductor
Max.
6.47
—
—
—
clock
Unit
ns
ns
ns
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