mt48h8m16lf Micron Semiconductor Products, mt48h8m16lf Datasheet - Page 12

• Manufacturer Part Number: mt48h8m16lf
• Description: 128mb 8 Meg X 16, 4 Meg X 32 Mobile Sdram
• Manufacturer: Micron Semiconductor Products

Package Dimensions
Figure 6:
PDF: 09005aef832ff1ea / Source: 09005aef832ff1ac
128mb_mobile_sdram_y35m__2.fm - Rev. B 6/08 EN
Dimensions apply
to solder balls
post-reflow. Pre-
reflow balls are
Ø0.42 on Ø0.4
SMD ball pads.
Exposed plated
features in all
corners are floating
nonbiased metal.
Seating
plane
54X Ø0.45
6.4
0.1 A
0.8 TYP
54-Ball VFBGA (8mm x 8mm)
3.2
Notes:
A
9
1. All dimensions are in millimeters.
8
3.2
7
8 ±0.1
6.4
4 ±0.05
3
2
1
A
B
C
D
E
F
G
H
J
0.8 TYP
128Mb: 8 Meg x 16, 4 Meg x 32 Mobile SDRAM
Ball A1 ID
4 ±0.05
12
0.65 ±0.05
8 ±0.1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
©2008 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Preliminary