DF2214BQ16V Renesas Electronics America, DF2214BQ16V Datasheet - Page 42

• Manufacturer Part Number: DF2214BQ16V
• Description: IC H8S/2214 MCU FLASH 112-TFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2214BQ16V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 112-TFBGA
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2218 - DEV EVAL KIT H8S/2218
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

12.2 Register Descriptions ......................................................................................................... 459
12.3 Operation ........................................................................................................................... 487
12.4 SCI Interrupts..................................................................................................................... 518
12.5 Usage Notes ....................................................................................................................... 520
Section 13 D/A Converter .................................................................................531
13.1 Overview............................................................................................................................ 531
13.2 Register Descriptions ......................................................................................................... 534
13.3 Operation ........................................................................................................................... 536
Section 14 RAM ................................................................................................539
14.1 Overview............................................................................................................................ 539
14.2 Register Descriptions ......................................................................................................... 540
14.3 Operation ........................................................................................................................... 541
Rev.4.00 Sep. 18, 2008 Page xl of lx
REJ09B0189-0400
12.1.3 Pin Configuration.................................................................................................. 457
12.1.4 Register Configuration.......................................................................................... 458
12.2.1 Receive Shift Register (RSR) ............................................................................... 459
12.2.2 Receive Data Register (RDR) ............................................................................... 459
12.2.3 Transmit Shift Register (TSR) .............................................................................. 460
12.2.4 Transmit Data Register (TDR).............................................................................. 460
12.2.5 Serial Mode Register (SMR) ................................................................................ 461
12.2.6 Serial Control Register (SCR)............................................................................... 464
12.2.7 Serial Status Register (SSR) ................................................................................. 467
12.2.8 Bit Rate Register (BRR) ....................................................................................... 472
12.2.9 Smart Card Mode Register (SCMR) ..................................................................... 480
12.2.10 Serial Extended Mode Register 0 (SEMR0) ......................................................... 481
12.2.11 Module Stop Control Register B (MSTPCRB)..................................................... 486
12.3.1 Overview............................................................................................................... 487
12.3.2 Operation in Asynchronous Mode ........................................................................ 490
12.3.3 Multiprocessor Communication Function............................................................. 501
12.3.4 Operation in Clocked Synchronous Mode ............................................................ 509
13.1.1 Features................................................................................................................. 531
13.1.2 Block Diagram...................................................................................................... 532
13.1.3 Pin Configuration.................................................................................................. 533
13.1.4 Register Configuration.......................................................................................... 533
13.2.1 D/A Data Register 0 (DADR0)............................................................................. 534
13.2.2 D/A Control Register (DACR) ............................................................................. 534
13.2.3 Module Stop Control Register C (MSTPCRC)..................................................... 535
14.1.1 Block Diagram...................................................................................................... 539
14.1.2 Register Configuration.......................................................................................... 540
14.2.1 System Control Register (SYSCR) ....................................................................... 540