DF2214BQ16V Renesas Electronics America, DF2214BQ16V Datasheet - Page 61

• Manufacturer Part Number: DF2214BQ16V
• Description: IC H8S/2214 MCU FLASH 112-TFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2214BQ16V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 112-TFBGA
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2218 - DEV EVAL KIT H8S/2218
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 15.10 Hardware Protection................................................................................................ 576
Table 15.11 Software Protection ................................................................................................. 577
Table 15.12 Programmer Mode Pin Settings............................................................................... 583
Table 15.13 Settings for Various Operating Modes In Programmer Mode................................. 585
Table 15.14 Programmer Mode Commands................................................................................ 586
Table 15.15 AC Characteristics in Transition to Memory Read Mode ....................................... 586
Table 15.16 AC Characteristics in Transition from Memory Read Mode to Another Mode ...... 587
Table 15.17 AC Characteristics in Memory Read Mode ............................................................ 588
Table 15.18 AC Characteristics in Auto-Program Mode ............................................................ 591
Table 15.19 AC Characteristics in Auto-Erase Mode ................................................................. 592
Table 15.20 AC Characteristics in Status Read Mode ................................................................ 594
Table 15.21 Status Read Mode Return Commands..................................................................... 595
Table 15.22 Status Polling Output Truth Table........................................................................... 595
Table 15.23 Stipulated Transition Times to Command Wait State ............................................. 596
Table 15.24 Flash Memory Operating States .............................................................................. 597
Table 15.25 Registers Present in F-ZTAT Version but Absent in Masked ROM Version ......... 604
Section 16 Clock Pulse Generator
Table 16.1
Table 16.2
Table 16.3
Table 16.4
Table 16.5
Section 17 Power-Down Modes
Table 17.1
Table 17.2
Table 17.3
Table 17.4
Table 17.5
Section 18 Electrical Characteristics
Table 18.1
Table 18.2
Table 18.3
Table 18.4
Table 18.5
Table 18.6
Table 18.7
Table 18.8
Table 18.9
Clock Pulse Generator Register............................................................................... 606
Damping Resistance Value...................................................................................... 609
Crystal Resonator Parameters.................................................................................. 610
External Clock Input Conditions ............................................................................. 612
External Clock Input Conditions when the Duty Adjustment Circuit Is not Used .. 612
LSI Internal States in Each Mode............................................................................ 618
Power-Down Mode Registers.................................................................................. 620
MSTP Bits and Corresponding On-Chip Supporting Modules ............................... 627
Oscillation Stabilization Time Settings ................................................................... 630
φ Pin State in Each Processing Mode ...................................................................... 633
Absolute Maximum Ratings.................................................................................... 635
DC Characteristics (1) ............................................................................................. 637
DC Characteristics (2) ............................................................................................. 639
DC Characteristics (3) ............................................................................................. 640
Permissible Output Currents.................................................................................... 641
Clock Timing........................................................................................................... 642
Control Signal Timing............................................................................................. 644
Bus Timing.............................................................................................................. 646
Timing of On-Chip Supporting Modules ................................................................ 653
Rev.4.00 Sep. 18, 2008 Page lix of lx
REJ09B0189-0400