DF2214BQ16V Renesas Electronics America, DF2214BQ16V Datasheet - Page 56

• Manufacturer Part Number: DF2214BQ16V
• Description: IC H8S/2214 MCU FLASH 112-TFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2214BQ16V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 112-TFBGA
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2218 - DEV EVAL KIT H8S/2218
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Figure C.27 Port F Block Diagram (Pin PF2) ............................................................................. 852
Figure C.28 Port F Block Diagram (Pin PF3) ............................................................................. 853
Figure C.29 Port F Block Diagram (Pins PF4 to PF6) ................................................................ 854
Figure C.30 Port F Block Diagram (Pin PF7) ............................................................................. 855
Figure C.31 Port G Block Diagram (Pin PG0)............................................................................ 856
Figure C.32 Port G Block Diagram (Pin PG1)............................................................................ 857
Figure C.33 Port G Block Diagram (Pins PG2 and PG3) ........................................................... 858
Figure C.34 Port G Block Diagram (Pin PG4)............................................................................ 859
Appendix E Timing of Transition to and Recovery from Hardware Standby Mode
Figure E.1
Figure E.2
Appendix G Package Dimensions
Figure G.1
Figure G.2
Figure G.3
Figure G.4
Rev.4.00 Sep. 18, 2008 Page liv of lx
REJ09B0189-0400
Timing of Transition to Hardware Standby Mode .................................................. 865
Timing of Recovery from Hardware Standby Mode............................................... 865
TFP-100B, TFP-100BV Package Dimensions ........................................................ 869
TFP-100G, TFP-100GA Package Dimensions........................................................ 870
TBP-112A, TBP-112AV Package Dimensions....................................................... 871
BP-112, BP-112V Package Dimensions ................................................................. 872