D6417709SF167BV Renesas Electronics America, D6417709SF167BV Datasheet - Page 273
D6417709SF167BV
Manufacturer Part Number
D6417709SF167BV
Description
IC SUPER H MPU ROMLESS 208LQFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet
1.D6417709SBP167BV.pdf
(809 pages)
Specifications of D6417709SF167BV
Core Processor
SH-3
Core Size
32-Bit
Speed
167MHz
Connectivity
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
96
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.75 V ~ 2.05 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
208-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
D6417709SF167BV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Pin Name
Data enable 3
Read
Wait
Clock enable
IOIS16
Bus release
request
Bus release
acknowledgment
Mask ROM chip
select
Signal
WE3/DQMUU/
ICIOWR
RD
WAIT
CKE
IOIS16
BREQ
BACK
MCS[0]– MCS[7] O
I/O
O
O
I
O
I
I
O
Description
When memory other than synchronous DRAM and
PCMCIA is used, D31–D24 write strobe signal.
When synchronous DRAM is used, selects D31–
D24. When PCMCIA is used, strobe signal
indicating I/O write.
Strobe signal indicating read cycle
Wait state request signal
Clock enable control signal for synchronous DRAM
Signal indicating PCMCIA 16-bit I/O. Valid only in
little-endian mode.
Bus release request signal
Bus release acknowledge signal
Chip select signal for mask ROM connected to area
0 or 2.
Rev. 5.00, 09/03, page 227 of 760
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