D6417709SF167BV Renesas Electronics America, D6417709SF167BV Datasheet - Page 795

• Manufacturer Part Number: D6417709SF167BV
• Description: IC SUPER H MPU ROMLESS 208LQFP
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7700r

Specifications of D6417709SF167BV

• Core Processor: SH-3
• Core Size: 32-Bit
• Speed: 167MHz
• Connectivity: EBI/EMI, FIFO, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 96
• Program Memory Type: ROMless
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.75 V ~ 2.05 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 208-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

BAMRA
BBRA
BETR
BRSR
BRDR
TRA
EXPEVT
INTEVT
MMUCR
Register
BDA23
BDA15
BSA23
BSA15
CDA1
BSA7
BDA7
Bit 7
DVF
SVF
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
BDA22
BDA14
BSA22
BSA14
CDA0
BDA6
BSA6
PID2
Bit 6
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
BDA21
BDA13
BSA21
BSA13
BDA5
BSA5
IDA1
PID1
Bit 5
RC
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
BDA20
BDA12
BSA20
BSA12
BDA4
BSA4
IDA0
PID0
Bit 4
RC
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
BSA27
BSA19
BSA11
BDA27
BDA19
BDA11
RWA1
BDA3
BSA3
Bit 3
—
—
—
—
—
—
—
—
—
—
—
—
BSA26
BSA18
BSA10
BDA26
BDA18
BDA10
RWA0
BDA2
BSA2
Bit 2
TF
—
—
—
—
—
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Rev. 5.00, 09/03, page 749 of 760
BSA25
BSA17
BDA25
BDA17
BDA9
BDA1
SZA1
BSA9
BSA1
Bit 1
—
—
—
—
—
—
—
—
—
—
—
IX
BSA24
BSA16
BDA24
BDA16
SZA0
BSA8
BSA0
BDA8
BDA0
Bit 0
SV
AT
—
—
—
—
—
—
—
—
—
—
Module
CCN
CCN
CCN
CCN
UBC
UBC
UBC
UBC
UBC