D6417709SF167BV Renesas Electronics America, D6417709SF167BV Datasheet - Page 35
![IC SUPER H MPU ROMLESS 208LQFP](/photos/12/31/123112/d6417709sf167bv_sml.jpg)
D6417709SF167BV
Manufacturer Part Number
D6417709SF167BV
Description
IC SUPER H MPU ROMLESS 208LQFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet
1.D6417709SBP167BV.pdf
(809 pages)
Specifications of D6417709SF167BV
Core Processor
SH-3
Core Size
32-Bit
Speed
167MHz
Connectivity
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
96
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.75 V ~ 2.05 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
208-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
D6417709SF167BV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Figure 10.28 Synchronous DRAM Mode Write Timing ........................................................... 303
Figure 10.29 Burst ROM Wait Access Timing ......................................................................... 305
Figure 10.30 Burst ROM Basic Access Timing ........................................................................ 306
Figure 10.31 Example of PCMCIA Interface ............................................................................ 308
Figure 10.32 Basic Timing for PCMCIA Memory Card Interface ............................................ 310
Figure 10.33 Wait Timing for PCMCIA Memory Card Interface ............................................. 311
Figure 10.34 Basic Timing for PCMCIA Memory Card Interface Burst Access ...................... 312
Figure 10.35 Wait Timing for PCMCIA Memory Card Interface Burst Access ....................... 313
Figure 10.36 PCMCIA Space Allocation .................................................................................. 314
Figure 10.37 Basic Timing for PCMCIA I/O Card Interface .................................................... 316
Figure 10.38 Wait Timing for PCMCIA I/O Card Interface ..................................................... 317
Figure 10.39 Dynamic Bus Sizing Timing for PCMCIA I/O Card Interface ............................ 318
Figure 10.40 Waits between Access Cycles .............................................................................. 320
Figure 10.41 Pull-Up Timing for Pins A25 to A0 ..................................................................... 321
Figure 10.42 Pull-Up Timing for Pins D31 to D0 (Read Cycle) ............................................... 322
Figure 10.43 Pull-Up Timing for Pins D31 to D0 (Write Cycle) .............................................. 322
Figure 11.1
Figure 11.2
Figure 11.3
Figure 11.4
Figure 11.5
Figure 11.6
Figure 11.7
Figure 11.8
Figure 11.9
Figure 11.10 Example of DMA Transfer Timing in Single Address Mode .............................. 358
Figure 11.11 Example of DMA Transfer Timing in Single Address Mode (16-byte Transfer,
Figure 11.12 Example of DMA Transfer in Cycle-Steal Mode................................................. 360
Figure 11.13 Example of Transfer in Burst Mode ..................................................................... 360
Figure 11.14 Bus State when Multiple Channels Are Operating............................................... 362
Figure 11.15 Cycle-Steal Mode, Level Input (CPU Access: 2 Cycles) ..................................... 365
Figure 11.16 Cycle-Steal Mode, Level Input (CPU Access: 3 Cycles) ..................................... 366
Figure 11.17 Cycle-Steal Mode, Level input (CPU Access: 2 Cycles, DMA RD Access:
Figure 11.18 Cycle-Steal Mode, Level input (CPU Access: 2 Cycles, DREQ Input Delayed) . 368
Figure 11.19 Cycle-Steal Mode, Edge input (CPU Access: 2 Cycles) ...................................... 369
Figure 11.20 Burst Mode, Level Input ...................................................................................... 370
Figure 11.21 Burst Mode, Edge Input ....................................................................................... 371
Figure 11.22 Source Address Reload Function Diagram........................................................... 372
Block Diagram of DMAC .................................................................................... 329
DMAC Transfer Flowchart .................................................................................. 346
Round-Robin Mode.............................................................................................. 350
Changes in Channel Priority in Round-Robin Mode............................................ 351
Operation of Direct Address Mode in Dual Address Mode ................................. 353
Example of DMA Transfer Timing in the Direct Address Mode in Dual Mode
(Transfer Source: Ordinary Memory, Transfer Destination: Ordinary Memory). 354
Indirect Address Operation in Dual Address Mode (When External Memory
Space has a 16-Bit Width).................................................................................... 355
Example of Transfer Timing in the Indirect Address Mode in Dual Address
Mode .................................................................................................................... 356
Data Flow in Single Address Mode...................................................................... 357
External Memory Space (Ordinary Memory)
4 Cycles)............................................................................................................... 367
External Device with DACK) . 359
Rev. 5.00, 09/03, page xxxiii of xliv
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