D6417709SF167BV Renesas Electronics America, D6417709SF167BV Datasheet - Page 6
![IC SUPER H MPU ROMLESS 208LQFP](/photos/12/31/123112/d6417709sf167bv_sml.jpg)
D6417709SF167BV
Manufacturer Part Number
D6417709SF167BV
Description
IC SUPER H MPU ROMLESS 208LQFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet
1.D6417709SBP167BV.pdf
(809 pages)
Specifications of D6417709SF167BV
Core Processor
SH-3
Core Size
32-Bit
Speed
167MHz
Connectivity
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
96
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.75 V ~ 2.05 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
208-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
D6417709SF167BV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any
3. All information contained in these materials, including product data, diagrams, charts,
4. When using any or all of the information contained in these materials, including product data,
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in
7. If these products or technologies are subject to the Japanese export control restrictions, they
8. Please contact Renesas Technology Corp. for further details on these materials or the products
Rev. 5.00, 09/03, page iv of xliv
better and more reliable, but there is always the possibility that trouble may occur with them.
Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with
appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of
nonflammable material or (iii) prevention against any malfunction or mishap.
Renesas Technology Corp. product best suited to the customer's application; they do not
convey any license under any intellectual property rights, or any other rights, belonging to
Renesas Technology Corp. or a third party.
third-party's rights, originating in the use of any product data, diagrams, charts, programs,
algorithms, or circuit application examples contained in these materials.
programs and algorithms represents information on products at the time of publication of these
materials, and are subject to change by Renesas Technology Corp. without notice due to
product improvements or other reasons. It is therefore recommended that customers contact
Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for
the latest product information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss
rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various
means, including the Renesas Technology Corp. Semiconductor home page
(http://www.renesas.com).
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total
system before making a final decision on the applicability of the information and products.
Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss
resulting from the information contained herein.
device or system that is used under circumstances in which human life is potentially at stake.
Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product
distributor when considering the use of a product contained herein for any specific purposes,
such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or
undersea repeater use.
whole or in part these materials.
must be exported under a license from the Japanese government and cannot be imported into a
country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or
the country of destination is prohibited.
contained therein.
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