ATMEGA32HVB-8X3 Atmel, ATMEGA32HVB-8X3 Datasheet - Page 136

MCU AVR 32KB FLASH 8MHZ 44TSSOP

ATMEGA32HVB-8X3

Manufacturer Part Number
ATMEGA32HVB-8X3
Description
MCU AVR 32KB FLASH 8MHZ 44TSSOP
Manufacturer
Atmel
Series
AVR® ATmegar
Datasheets

Specifications of ATMEGA32HVB-8X3

Core Processor
AVR
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C, SPI
Peripherals
POR, WDT
Number Of I /o
17
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
4 V ~ 25 V
Data Converters
A/D 7x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
44-TSSOP
Processor Series
ATMEGA32x
Core
AVR8
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SPI, TWI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
17
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, ATAVRSB200
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 7 Channel
Package
44TSSOP
Device Core
AVR
Family Name
ATmega
Maximum Speed
8 MHz
Operating Supply Voltage
5|9|12|15|18|24 V
For Use With
ATSTK524 - KIT STARTER ATMEGA32M1/MEGA32C1ATSTK600 - DEV KIT FOR AVR/AVR32ATAVRDRAGON - KIT DRAGON 32KB FLASH MEM AVRATSTK500 - PROGRAMMER AVR STARTER KIT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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24.3
24.3.1
24.3.2
24.3.3
24.3.4
8042B–AVR–06/10
Operation
Short-circuit Protection
Discharge Over-current Protection
Charge Over-current Protection
Discharge High-current Protection
The Current Battery Protections (CBP) monitors the cell current by sampling the shunt resistor
voltage at the PPI/NNI input pins. A differential operational amplifier amplifies the voltage with a
suitable gain. The output from the operational amplifier is compared to an accurate, programma-
ble On-chip voltage reference by an Analog Comparator. If the shunt resistor voltage is above
the Detection level for a time longer than the corresponding Protection Reaction Time, the chip
activates Current Protection. A sampled system clocked by the internal ULP Oscillator is used
for Short-circuit, Over-current, and High-current Protection. This ensures a reliable clock source,
offset cancellation and low power consumption.
The Short-circuit detection is provided to enable a fast response time to very large discharge
currents. If the voltage at the PPI/NNI pins is above the Short-circuit Detection Level for a period
longer than Short-circuit Reaction Time, the Short-circuit Protection is activated.
When the Short-circuit Protection is activated, the external D-FET and C-FET are disabled and a
Current Protection Timer is started. This timer ensures that the D-FET and C-FET are disabled
for at least one second. The application software must then set the DFE and CFE bits in the FET
Control and Status Register to re-enable normal operation. If the D-FET is re-enabled before the
cause of the short-circuit condition is removed, the Short-circuit Protection will be activated
again.
If the voltage at the PPI/NNI pins is above the Discharge Over-current Detection level for a time
longer than Over-current Protection Reaction Time, the chip activates Discharge Over-current
Protection.
When the Discharge Over-current Protection is activated, the external D-FET and C-FET are
disabled and a Current Protection Timer is started. This timer ensures that the FETs are dis-
abled for at least one second. The application software must then set the DFE and CFE bits in
the FET Control and Status Register to re-enable normal operation. If the D-FET is re-enabled
while the loading of the battery still is too large, the Discharge Over-current Protection will be
activated again.
If the voltage at the PPI/NNI pins is above the Charge Over-current Detection level for a time
longer than Over-current Protection Reaction Time, the chip activates Charge Over-current
Protection.
When the Charge Over-current Protection is activated, the external D-FET and C-FET are dis-
abled and a Current Protection Timer is started. This timer ensures that the FETs are disabled
for at least one second. The application software must then set the DFE and CFE bits in the FET
Control and Status Register to re-enable normal operation. If the C-FET is re-enabled and the
charger continues to supply too high currents, the Charge Over-current Protection will be acti-
vated again.
If the voltage at the PPI/NNI pins is above the Discharge High-current Detection level for a time
longer than High-current Protection Reaction Time, the chip activates Discharge High-current
Protection.
ATmega16HVB/32HVB
136

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