MC9S12DT256MPVE Freescale Semiconductor, MC9S12DT256MPVE Datasheet - Page 1292
![IC MCU 256K FLASH 25MHZ 112-LQFP](/photos/37/62/376255/lqfp-112_sml.jpg)
MC9S12DT256MPVE
Manufacturer Part Number
MC9S12DT256MPVE
Description
IC MCU 256K FLASH 25MHZ 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet
1.S912XDG128F2MAL.pdf
(1348 pages)
Specifications of MC9S12DT256MPVE
Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
CAN, I²C, SCI, SPI
Peripherals
PWM, WDT
Number Of I /o
91
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.25 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
112-LQFP
Processor Series
S12D
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
12 KB
Interface Type
CAN/I2C/SCI/SPI
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
91
Number Of Timers
1
Operating Supply Voltage
5 V to 2.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
M68KIT912DP256
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (8-ch x 10-bit)
No. Of I/o's
91
Eeprom Memory Size
4KB
Ram Memory Size
12KB
Cpu Speed
25MHz
No. Of Timers
1
No. Of Pwm Channels
8
Digital Ic Case Style
LQFP
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12DT256MPVE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Appendix C Recommended PCB Layout
Appendix C
Recommended PCB Layout
The PCB must be carefully laid out to ensure proper operation of the voltage regulator as well as of the
MCU itself. The following rules must be observed:
1294
•
•
•
•
•
•
•
Every supply pair must be decoupled by a ceramic capacitor connected as near as possible to the
corresponding pins (C1–C6).
Central point of the ground star should be the V
Use low ohmic low inductance connections between V
V
Keep traces of V
C8, and Q1 as small as possible.
Do not place other signals or supplies underneath area occupied by C7, C8, and Q1 and the
connection area to the MCU.
Central power input should be fed in at the V
SSPLL
must be directly connected to V
SSPLL
, EXTAL, and XTAL as short as possible and occupied board area for C7,
MC9S12XDP512 Data Sheet, Rev. 2.21
SSR
.
DDA
SSR
/V
SSA
pin.
SS1
pins.
, V
SS2
, and V
SSR
.
Freescale Semiconductor
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