MC9S12DT256MPVE Freescale Semiconductor, MC9S12DT256MPVE Datasheet - Page 580

• Manufacturer Part Number: MC9S12DT256MPVE
• Description: IC MCU 256K FLASH 25MHZ 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12DT256MPVE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I²C, SCI, SPI
• Peripherals: PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 112-LQFP
• Processor Series: S12D
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 12 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 1
• Operating Supply Voltage: 5 V to 2.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: M68KIT912DP256
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (8-ch x 10-bit)
• No. Of I/o's: 91
• Eeprom Memory Size: 4KB
• Ram Memory Size: 12KB
• Cpu Speed: 25MHz
• No. Of Timers: 1
• No. Of Pwm Channels: 8
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 15 Background Debug Module (S12XBDMV2)
15.4.4
Firmware commands are used to access and manipulate CPU resources. The system must be in active
BDM to execute standard BDM firmware commands, see
BDM”. Normal instruction execution is suspended while the CPU executes the firmware located in the
standard BDM firmware lookup table. The hardware command BACKGROUND is the usual way to
activate BDM.
As the system enters active BDM, the standard BDM firmware lookup table and BDM registers become
visible in the on-chip memory map at 0x7FFF00–0x7FFFFF, and the CPU begins executing the standard
BDM firmware. The standard BDM firmware watches for serial commands and executes them as they are
received.
The firmware commands are shown in
580
BACKGROUND
ACK_ENABLE
ACK_DISABLE
READ_BD_BYTE
READ_BD_WORD
READ_BYTE
READ_WORD
WRITE_BD_BYTE
WRITE_BD_WORD
WRITE_BYTE
WRITE_WORD
NOTE:
If enabled, ACK will occur when data is ready for transmission for all BDM READ commands and will occur after the write is
complete for all BDM WRITE commands.
Command
Standard BDM Firmware Commands
Opcode
(hex)
CC
EC
D5
D6
E4
E0
E8
C4
C0
C8
90
16-bit data out
16-bit data out
16-bit data out
16-bit data out
16-bit address
16-bit address
16-bit address
16-bit address
16-bit address
16-bit address
16-bit address
16-bit address
16-bit data in
16-bit data in
16-bit data in
16-bit data in
None
None
None
Data
MC9S12XDP512 Data Sheet, Rev. 2.21
Table 15-5. Hardware Commands
Table
Enter background mode if firmware is enabled. If enabled, an ACK will be
issued when the part enters active background mode.
Enable Handshake. Issues an ACK pulse after the command is executed.
Disable Handshake. This command does not issue an ACK pulse.
Read from memory with standard BDM firmware lookup table in map.
Odd address data on low byte; even address data on high byte.
Read from memory with standard BDM firmware lookup table in map.
Must be aligned access.
Read from memory with standard BDM firmware lookup table out of map.
Odd address data on low byte; even address data on high byte.
Read from memory with standard BDM firmware lookup table out of map.
Must be aligned access.
Write to memory with standard BDM firmware lookup table in map.
Odd address data on low byte; even address data on high byte.
Write to memory with standard BDM firmware lookup table in map.
Must be aligned access.
Write to memory with standard BDM firmware lookup table out of map.
Odd address data on low byte; even address data on high byte.
Write to memory with standard BDM firmware lookup table out of map.
Must be aligned access.
15-6.
Section 15.4.2, “Enabling and Activating
Description
Freescale Semiconductor