DSPB56362AG120 Freescale Semiconductor, DSPB56362AG120 Datasheet - Page 109

• Manufacturer Part Number: DSPB56362AG120
• Description: IC DSP 24BIT AUD 120MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: Symphony™r
• Type: Audio Processorr

Specifications of DSPB56362AG120

• Interface: Host Interface, I²C, SAI, SPI
• Clock Rate: 120MHz
• Non-volatile Memory: ROM (126 kB)
• On-chip Ram: 42kB
• Voltage - I/o: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Device Core Size: 24b
• Architecture: Modified Harvard
• Format: Fixed Point
• Clock Freq (max): 120MHz
• Mips: 120
• Device Input Clock Speed: 120MHz
• Ram Size: 42KB
• Program Memory Size: 90KB
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 3.14V
• Operating Supply Voltage (max): 3.46V
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Product: DSPs
• Data Bus Width: 24 bit
• Processor Series: DSP563xx
• Core: 56000
• Numeric And Arithmetic Format: Fixed-Point
• Instruction Set Architecture: Modified Harvard
• Device Million Instructions Per Second: 120 MIPS
• Maximum Clock Frequency: 120 MHz
• Program Memory Type: Flash
• Data Ram Size: 42 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Interface Type: SPI, I2C, ESAI, SHI
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

5
5.1
An estimation of the chip junction temperature, T
Where:
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and
a case-to-ambient thermal resistance.
Where:
R
change the case-to-ambient thermal resistance, R
the device, add a heat sink, change the mounting arrangement on the printed circuit board (PCB), or
otherwise change the thermal dissipation capability of the area surrounding the device on a PCB. This
model is most useful for ceramic packages with heat sinks; some 90% of the heat flow is dissipated through
the case to the heat sink and out to the ambient environment. For ceramic packages, in situations where
the heat flow is split between a path to the case and an alternate path through the PCB, analysis of the
device thermal performance may need the additional modeling capability of a system level thermal
simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which
the package is mounted. Again, if the estimations obtained from R
the thermal performance is adequate, a system level model may be appropriate.
A complicating factor is the existence of three common ways for determining the junction-to-case thermal
resistance in plastic packages.
Freescale Semiconductor
θJC
is device-related and cannot be influenced by the user. The user controls the thermal environment to
Design Considerations
T
R
P
R
R
R
A
D
θJA
θJA
θJC
θCA
Thermal Design Considerations
= ambient temperature °C
= package junction-to-ambient thermal resistance °C/W
= power dissipation in package W
= package junction-to-ambient thermal resistance °C/W
= package junction-to-case thermal resistance °C/W
= package case-to-ambient thermal resistance °C/W
DSP56362 Technical Data, Rev. 4
T
R
J
θJA
=
T
=
A
θCA
J
+
R
, in °C can be obtained from the following equation:
(
θJC
. For example, the user can change the air flow around
P
D
+
×
R
R
θCA
θJA
)
θJA
do not satisfactorily answer whether
5-1