DSPB56362AG120 Freescale Semiconductor, DSPB56362AG120 Datasheet - Page 4

IC DSP 24BIT AUD 120MHZ 144-LQFP

DSPB56362AG120

Manufacturer Part Number
DSPB56362AG120
Description
IC DSP 24BIT AUD 120MHZ 144-LQFP
Manufacturer
Freescale Semiconductor
Series
Symphony™r
Type
Audio Processorr
Datasheet

Specifications of DSPB56362AG120

Interface
Host Interface, I²C, SAI, SPI
Clock Rate
120MHz
Non-volatile Memory
ROM (126 kB)
On-chip Ram
42kB
Voltage - I/o
3.30V
Voltage - Core
3.30V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
144-LQFP
Device Core Size
24b
Architecture
Modified Harvard
Format
Fixed Point
Clock Freq (max)
120MHz
Mips
120
Device Input Clock Speed
120MHz
Ram Size
42KB
Program Memory Size
90KB
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3.14V
Operating Supply Voltage (max)
3.46V
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
Product
DSPs
Data Bus Width
24 bit
Processor Series
DSP563xx
Core
56000
Numeric And Arithmetic Format
Fixed-Point
Instruction Set Architecture
Modified Harvard
Device Million Instructions Per Second
120 MIPS
Maximum Clock Frequency
120 MHz
Program Memory Type
Flash
Data Ram Size
42 KB
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Interface Type
SPI, I2C, ESAI, SHI
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Overview
1. These ROMs may be factory programmed with data or programs provided by the application developer.
1-4
.
On-Chip Memories
— Modified Harvard architecture allows simultaneous access to program and data memories
— 30720 x 24-bit on-chip program ROM
— 6144 x 24-bit on-chip X-data ROM
— 6144 x 24-bit on-chip Y-data ROM
— Program RAM, instruction cache, X data RAM, and Y data RAM sizes are programmable
— 192 x 24-bit bootstrap ROM (disabled in sixteen-bit compatibility mode)
Off-Chip Memory Expansion
— Data memory expansion to 256K x 24-bit word memory for P, X, and Y memory using SRAM.
— Data memory expansion to 16M x 24-bit word memory for P, X, and Y memory using DRAM.
— External memory expansion port( twenty-four data pins for high speed external memory access
— Chip select logic for glueless interface to SRAMs
— On-chip DRAM controller for glueless interface to DRAMs
Peripheral and Support Circuits
— Enhanced serial audio interface (ESAI) includes:
— Serial host interface (SHI) features:
— Byte-wide parallel host interface (HDI08) with DMA support
— DAX features one serial transmitter capable of supporting S/PDIF, IEC958, IEC1937, CP-340,
Instruction
Disabled
Disabled
Enabled
Enabled
– On-Chip Emulation (OnCE‘) module
– Joint Action Test Group (JTAG) test access port (TAP)
– Address trace mode reflects internal program RAM accesses at the external port
allowing for a large number of external accesses per sample)
– Six serial data lines, 4 selectable as receive or transmit and 2 transmit only.
– Master or slave capability
– I
– SPI protocol with multi-master capability
– I
– Ten-word receive FIFO
– Support for 8-, 16-, and 24-bit words.
and AES/EBU digital audio formats; alternate configuration supports up to two GPIO lines
Cache
2
2
S, Sony, AC97, and other audio protocol implementations
C protocol with single-master capability
Disabled
Disabled
Enabled
Enabled
Switch
Mode
Program RAM
3072 × 24-bit
2048 × 24-bit
5120 × 24-bit
4096 × 24-bit
DSP56362 Technical Data, Rev. 4
Size
1
1
1
(disabled in 16-bit compatibility mode)
1024 × 24-bit
1024 × 24-bit
Cache Size
Instruction
0
0
X Data RAM Size Y Data RAM Size
5632 × 24-bit
5632 × 24-bit
5632 × 24-bit
5632 × 24-bit
5632 × 24-bit
5632 × 24-bit
3584 × 24-bit
3584 × 24-bit
Freescale Semiconductor

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