mt47h64m16hw-3 Micron Semiconductor Products, mt47h64m16hw-3 Datasheet - Page 2

• Manufacturer Part Number: mt47h64m16hw-3
• Description: 1gb X4, X8, X16 Ddr2 Sdram
• Manufacturer: Micron Semiconductor Products

Table 2:
Figure 1:
FBGA Part Number System
PDF: 09005aef821ae8bf/Source: 09005aef821aed36
1Gb_DDR2_x4x8x16_D1.fm - 1Gb DDR2: Rev. N; Core DDR2: Rev. C 4/08 EN
Parameter
Configuration
Refresh count
Row address
Bank address
Column address
Addressing
1Gb DDR2 Part Numbers
Notes:
1. Not all speeds and configurations are available in all packages.
Due to space limitations, FBGA-packaged components have an abbreviated part
marking that is different from the part number. For a quick conversion of an FBGA code,
see the FBGA Part Marking Decoder on Micron’s Web site: www.micron.com.
Package
Pb-free
92-ball 11mm x 19mm FBGA
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 11.5mm FBGA
Lead solder
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 11.5mm FBGA
Configuration
MT47H
256 Meg x 4
128 Meg x 8
64 Meg x 16
32 Meg x 4 x 8 banks
A0–A9, A11 (2K)
A0–A13 (16K)
256 Meg x 4
BA0–BA2 (8)
Example Part Number: M T 4 7 H 1 2 8 M 8 B T- 3 7 E
8K
256M4
128M8
64M16
Configuration
2
Package
HW
HQ
HV
HR
BT
16 Meg x 8 x 8 banks
-
Micron Technology, Inc., reserves the right to change products or specifications without notice.
A0–A13 (16K)
128 Meg x 8
BA0–BA2 (8)
Speed
A0–A9 (1K)
-187E
-25E
-37E
-25
-3E
-5E
-3
IT
L
8K
Industrial temperature
t CK = 1.875ns, CL = 7
t CK = 2.5ns, CL = 5
t CK = 2.5ns, CL = 6
t CK = 3ns, CL = 4
t CK = 3ns, CL = 5
t CK = 3.75ns, CL = 4
t CK = 5ns, CL = 3
1Gb: x4, x8, x16 DDR2 SDRAM
Speed Grade
Low power
:A/:E/:G
Revision
:
Revision
©2004 Micron Technology, Inc. All rights reserved.
8 Meg x 16 x 8 banks
64 Meg x 16
A0–A12 (8K)
BA0–BA2 (8)
A0–A9 (1K)
8K
Features