mt47h64m16hw-3 Micron Semiconductor Products, mt47h64m16hw-3 Datasheet - Page 51
mt47h64m16hw-3
Manufacturer Part Number
mt47h64m16hw-3
Description
1gb X4, X8, X16 Ddr2 Sdram
Manufacturer
Micron Semiconductor Products
Datasheet
1.MT47H64M16HW-3.pdf
(125 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
mt47h64m16hw-3 IT:H
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Company:
Part Number:
mt47h64m16hw-3:H
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Power and Ground Clamp Characteristics
Table 26:
Figure 22:
PDF: 09005aef8117c187/Source: 09005aef821aed36
DDR2_x4x8x16_Core2.fm - 1Gb DDR2: Rev. N; Core DDR2: Rev. C 4/08 EN
Input Clamp Characteristics
Input Clamp Characteristics
Power and ground clamps are provided on the following input-only balls: Address balls,
bank address balls, CS#, RAS#, CAS#, WE#, ODT, and CKE.
25
20
15
10
5
0
Voltage Across Clamp
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8
(V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
51
Minimum Power Clamp
Voltage Across Clamp (V)
Power and Ground Clamp Characteristics
Current (mA)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
11.0
13.5
16.0
18.2
21.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.1
1.0
2.5
4.7
6.8
9.1
1Gb: x4, x8, x16 DDR2 SDRAM
Minimum Ground Clamp
©2003 Micron Technology, Inc. All rights reserved.
Current (mA)
11.0
13.5
16.0
18.2
21.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.1
1.0
2.5
4.7
6.8
9.1