MT29F2G08ABAEAH4-IT:E Micron Technology Inc, MT29F2G08ABAEAH4-IT:E Datasheet - Page 5

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MT29F2G08ABAEAH4-IT:E

Manufacturer Part Number
MT29F2G08ABAEAH4-IT:E
Description
IC FLASH 2G 3.3V SLC 63VFBGA
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT29F2G08ABAEAH4-IT:E

Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
2G (256M x 8)
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
63-VFBGA
Cell Type
NAND
Density
2Gb
Interface Type
Parallel
Address Bus
28b
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
-40C to 85C
Package Type
VFBGA
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
256M
Supply Current
35mA
Mounting
Surface Mount
Pin Count
63
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Speed
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT29F2G08ABAEAH4-IT:E
Manufacturer:
MICRON
Quantity:
2 000
Part Number:
MT29F2G08ABAEAH4-IT:E
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT29F2G08ABAEAH4-IT:E
Manufacturer:
MICRON/镁光
Quantity:
20 000
Part Number:
MT29F2G08ABAEAH4-IT:E
0
Company:
Part Number:
MT29F2G08ABAEAH4-IT:E
Quantity:
9 800
Micron Confidential and Proprietary
2Gb: x8, x16 NAND Flash Memory
Features
List of Tables
Table 1: Signal Definitions ............................................................................................................................... 8
Table 2: Array Addressing – MT29F2G08 (x8) .................................................................................................. 16
Table 3: Array Addressing – MT29F2G16 (x16) ................................................................................................ 17
Table 4: Asynchronous Interface Mode Selection ........................................................................................... 18
Table 5: Command Set .................................................................................................................................. 29
Table 6: Two-Plane Command Set ................................................................................................................. 30
Table 7: READ ID Parameters for Address 00h ................................................................................................ 34
Table 8: READ ID Parameters for Address 20h ................................................................................................ 35
Table 9: Parameter Page Data Structure ......................................................................................................... 37
Table 10: Feature Address Definitions ............................................................................................................ 42
Table 11: Feature Address 90h – Array Operation Mode .................................................................................. 43
Table 12: Feature Addresses 01h: Timing Mode .............................................................................................. 45
Table 13: Feature Addresses 80h: Programmable I/O Drive Strength ............................................................... 46
Table 14: Feature Addresses 81h: Programmable R/B# Pull-Down Strength ..................................................... 46
Table 15: Status Register Definition ............................................................................................................... 47
Table 16: Block Lock Address Cycle Assignments ............................................................................................ 78
Table 17: Block Lock Status Register Bit Definitions ........................................................................................ 81
Table 18: Error Management Details ............................................................................................................. 100
Table 19: Absolute Maximum Ratings ........................................................................................................... 104
Table 20: Recommended Operating Conditions ............................................................................................ 104
Table 21: Valid Blocks ................................................................................................................................... 104
Table 22: Capacitance .................................................................................................................................. 105
Table 23: Test Conditions ............................................................................................................................. 105
Table 24: DC Characteristics and Operating Conditions (3.3V) ....................................................................... 106
Table 25: DC Characteristics and Operating Conditions (1.8V) ....................................................................... 107
Table 26: AC Characteristics: Command, Data, and Address Input (3.3V) ........................................................ 108
Table 27: AC Characteristics: Command, Data, and Address Input (1.8V) ........................................................ 108
Table 28: AC Characteristics: Normal Operation (3.3V) .................................................................................. 109
Table 29: AC Characteristics: Normal Operation (1.8V) .................................................................................. 109
Table 30: Program/Erase Characteristics ....................................................................................................... 111
5
PDF: 09005aef83b83f42
Micron Technology, Inc. reserves the right to change products or specifications without notice.
m69a_2gb_nand.pdf – Rev. H 09/10 EN
© 2009 Micron Technology, Inc. All rights reserved.

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