MT29F2G08ABAEAH4-IT:E Micron Technology Inc, MT29F2G08ABAEAH4-IT:E Datasheet - Page 61

• Manufacturer Part Number: MT29F2G08ABAEAH4-IT:E
• Description: IC FLASH 2G 3.3V SLC 63VFBGA
• Manufacturer: Micron Technology Inc

Specifications of MT29F2G08ABAEAH4-IT:E

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 2G (256M x 8)
• Interface: Parallel
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 63-VFBGA
• Cell Type: NAND
• Density: 2Gb
• Interface Type: Parallel
• Address Bus: 28b
• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Package Type: VFBGA
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8b
• Number Of Words: 256M
• Supply Current: 35mA
• Mounting: Surface Mount
• Pin Count: 63
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Speed: -
• Lead Free Status / Rohs Status: Compliant

READ PAGE CACHE LAST (3Fh)
Figure 40: READ PAGE CACHE LAST (3Fh) Operation
PDF: 09005aef83b83f42
m69a_2gb_nand.pdf – Rev. H 09/10 EN
Cycle type
I/O[7:0]
RDY
(SEQUENTIAL OR RANDOM)
READ PAGE CACHE
Page Address N
As defined for
Command
31h
t
WB
t
RCBSY
The READ PAGE CACHE LAST (3Fh) command ends the read page cache sequence and
copies a page from the data register to the cache register. This command is accepted by
the die (LUN) when it is ready (RDY = 1, ARDY = 1). It is also accepted by the die (LUN)
during READ PAGE CACHE (31h, 00h-31h) operations (RDY = 1 and ARDY = 0).
To issue the READ PAGE CACHE LAST (3Fh) command, write 3Fh to the command reg-
ister. After this command is issued, R/B# goes LOW and the die (LUN) is busy
(RDY = 0, ARDY = 0) for
ready (RDY = 1, ARDY = 1). At this point, data can be output from the cache register,
beginning at column address 0. The RANDOM DATA READ (05h-E0h) command can be
used to change the column address of the data being output from the cache register.
In devices that have more than one LUN per target, during and following interleaved
die (multi-LUN) operations the READ STATUS ENHANCED (78h) command followed
by the READ MODE (00h) command must be used to select only one die (LUN) and
prevent bus contention.
t
RR
D
D0
OUT
D
…
OUT
t
RCBSY. After
D
D
OUT
61
n
Command
t
3Fh
RCBSY, R/B# goes HIGH and the die (LUN) is
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2Gb: x8, x16 NAND Flash Memory
t
WB
t
RCBSY
t
RR
D
© 2009 Micron Technology, Inc. All rights reserved.
D0
OUT
Read Operations
Page N
D
…
OUT
D
D
OUT
n