MT29F2G08ABAEAH4-IT:E Micron Technology Inc, MT29F2G08ABAEAH4-IT:E Datasheet - Page 99

• Manufacturer Part Number: MT29F2G08ABAEAH4-IT:E
• Description: IC FLASH 2G 3.3V SLC 63VFBGA
• Manufacturer: Micron Technology Inc

Specifications of MT29F2G08ABAEAH4-IT:E

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 2G (256M x 8)
• Interface: Parallel
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 63-VFBGA
• Cell Type: NAND
• Density: 2Gb
• Interface Type: Parallel
• Address Bus: 28b
• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Package Type: VFBGA
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8b
• Number Of Words: 256M
• Supply Current: 35mA
• Mounting: Surface Mount
• Pin Count: 63
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Speed: -
• Lead Free Status / Rohs Status: Compliant

Interleaved Die (Multi-LUN) Operations
PDF: 09005aef83b83f42
m69a_2gb_nand.pdf – Rev. H 09/10 EN
In devices that have more than one die (LUN) per target, it is possible to improve per-
formance by interleaving operations between the die (LUNs). An interleaved die (multi-
LUN) operation is one that is issued to an idle die (LUN) (RDY = 1) while another die
(LUN) is busy (RDY = 0).
Interleaved die (multi-LUN) operations are prohibited following RESET (FFh), identifi-
cation (90h, ECh, EDh), and configuration (EEh, EFh) operations until ARDY =1 for all of
the die (LUNs) on the target.
During an interleaved die (multi-LUN) operation, there are two methods to determine
operation completion. The R/B# signal indicates when all of the die (LUNs) have finish-
ed their operations. R/B# remains LOW while any die (LUN) is busy. When R/B# goes
HIGH, all of the die (LUNs) are idle and the operations are complete. Alternatively, the
READ STATUS ENHANCED (78h) command can report the status of each die (LUN) in-
dividually.
If a die (LUN) is performing a cache operation, like PROGRAM PAGE CACHE (80h-15h),
then the die (LUN) is able to accept the data for another cache operation when status
register bit 6 is 1. All operations, including cache operations, are complete on a die
when status register bit 5 is 1.
During and following interleaved die (multi-LUN) operations, the READ STATUS (70h)
command is prohibited. Instead, use the READ STATUS ENHANCED (78h) command
to monitor status. This command selects which die (LUN) will report status. When two-
plane commands are used with interleaved die (multi-LUN) operations, the two-plane
commands must also meet the requirements in Two-Plane Operations.
See Command Definitions for the list of commands that can be issued while other die
(LUNs) are busy.
During an interleaved die (multi-LUN) operation that involves a PROGRAM series
(80h-10h, 80h-15h) operation and a READ operation, the PROGRAM series operation
must be issued before the READ series operation. The data from the READ series opera-
tion must be output to the host before the next PROGRAM series operation is issued.
This is because the 80h command clears the cache register contents of all cache regis-
ters on all planes.
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Interleaved Die (Multi-LUN) Operations
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2Gb: x8, x16 NAND Flash Memory
© 2009 Micron Technology, Inc. All rights reserved.