D6417709SHF200BV Renesas Electronics America, D6417709SHF200BV Datasheet - Page 401

• Manufacturer Part Number: D6417709SHF200BV
• Description: IC SUPER H MPU ROMLESS 208LQFP
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7700r

Specifications of D6417709SHF200BV

• Core Processor: SH-3
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, FIFO, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 96
• Program Memory Type: ROMless
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.85 V ~ 2.15 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 208-QFP Exposed Pad, 208-eQFP, 208-HQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

Figure 11.7 Indirect Address Operation in Dual Address Mode
When the value in SAR3 is an address, the memory data is read and
the value is stored in the temporary buffer. The value to be read must
be 32 bits since it is used for the address. If data bus connected to an
external memory space is 16 bits wide, two bus cycles are necessary.
When the value in the temporary buffer is an address, the data is read
from the transfer source module to the data buffer.
When the value in SAR3 is an address, the value in the data buffer is
written to the transfer source module.
Note: This example shows memory, the transfer source module, and
(When External Memory Space has a 16-Bit Width)
M
M
D
C
D
C
M
A
A
D
A
C
the transfer destination module; in practice, any module can be
connected in the addressing space.
Temporary
Temporary
Temporary
DAR3
DAR3
buffer
buffer
SAR3
SAR3
buffer
buffer
SAR3
DAR3
buffer
buffer
Data
Data
Data
First and second bus cycles
Third bus cycle
Fourth bus cycle
Transfer destination
Transfer destination
Transfer destination
Transfer source
Transfer source
Transfer source
Memory
module
Memory
Memory
module
module
module
module
module
Rev. 5.00, 09/03, page 355 of 760