D6417709SHF200BV Renesas Electronics America, D6417709SHF200BV Datasheet - Page 734
![IC SUPER H MPU ROMLESS 208LQFP](/photos/12/31/123130/d6417709shf200bv_sml.jpg)
D6417709SHF200BV
Manufacturer Part Number
D6417709SHF200BV
Description
IC SUPER H MPU ROMLESS 208LQFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet
1.D6417709SBP167BV.pdf
(809 pages)
Specifications of D6417709SHF200BV
Core Processor
SH-3
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
96
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.85 V ~ 2.15 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
208-QFP Exposed Pad, 208-eQFP, 208-HQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
D6417709SHF200BV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Rev. 5.00, 09/03, page 688 of 760
Figure 23.29 Synchronous DRAM Write Bus Cycle (Burst Mode (Single Write
CKIO
CSn
RD/WR
RAS
CAS
DQMxx
BS
CKE
A25 to A16
A12 or A10
A15 to A0
D31 to D0
DACKn
tRASD2
t DAKD1
tRWD
tAD
tAD
tAD
tCSD3
Tr
Row
address
Row
address
Row address
RCD
tRASD2
tAD
tAD
Trw
1, TPC
tCASD2
tDQMD
tBSD
tRWD
tWDD2
Tc1
(High)
tWDD2
Column address (1-4)
Write command
Tc2
0, TRWL = 0)
Tc3
tAD
Td4
Write A
command
tAD
t DAKD1
tDQMD
tBSD
tRWD
tCASD2
tWDH2
tAD
tCSD3
tAD
(Trwl)
(Tpc)
4),
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