D13007VX13V Renesas Electronics America, D13007VX13V Datasheet - Page 517

MCU 3V 0K 100-TQFP

D13007VX13V

Manufacturer Part Number
D13007VX13V
Description
MCU 3V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of D13007VX13V

Core Processor
H8/300H
Core Size
16-Bit
Speed
13MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
14.1
An IC card (smart card) interface conforming to the ISO/IEC 7816-3 (Identification Card)
standard is supported as an extension of the serial communication interface (SCI) functions.
Switchover between the normal serial communication interface and the smart card interface is
controlled by a register setting.
14.1.1
Features of the smart card interface supported by the H8/3067 Group are listed below.
• Asynchronous communication
• Built-in baud rate generator allows any bit rate to be selected
• Three interrupt sources
⎯ Data length: 8 bits
⎯ Parity bit generation and checking
⎯ Transmission of error signal (parity error) in receive mode
⎯ Error signal detection and automatic data retransmission in transmit mode
⎯ Direct convention and inverse convention both supported
⎯ There are three interrupt sources ⎯ transmit-data-empty, receive-data-full, and
⎯ The transmit-data-empty interrupt and receive-data-full interrupt can activate the DMA
transmit/receive error ⎯ that can issue requests independently.
controller (DMAC) to execute data transfer.
Overview
Features
Section 14 Smart Card Interface
Rev.5.00 Sep. 12, 2007 Page 487 of 764
14. Smart Card Interface
REJ09B0396-0500

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