D13007VX13V Renesas Electronics America, D13007VX13V Datasheet - Page 782

MCU 3V 0K 100-TQFP

D13007VX13V

Manufacturer Part Number
D13007VX13V
Description
MCU 3V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of D13007VX13V

Core Processor
H8/300H
Core Size
16-Bit
Speed
13MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Appendix E Timing of Transition to and Recovery from Hardware Standby Mode
Timing of Transition to Hardware Standby Mode
(1) To retain RAM contents with the RAME bit set to 1 in SYSCR, drive the RES signal low 10
(2) To retain RAM contents with the RAME bit cleared to 0 in SYSCR, or when RAM contents
Timing of Recovery from Hardware Standby Mode: Drive the RES signal low approximately
100 ns before STBY goes high.
Rev.5.00 Sep. 12, 2007 Page 752 of 764
REJ09B0396-0500
STBY
RES
STBY
RES
Appendix E Timing of Transition to and Recovery from
system clock cycles before the STBY signal goes low, as shown below. RES must r⊕emain
low until STBY goes low (minimum delay from STBY low to RES high: 0 ns).
do not need to be retained, RES does not have to be driven low as in (1).
Hardware Standby Mode
t
1
≥ 10t
t ≥ 100 ns
cyc
t
2
≥ 0 ns
t
OSC

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