D13007VX13V Renesas Electronics America, D13007VX13V Datasheet - Page 523

• Manufacturer Part Number: D13007VX13V
• Description: MCU 3V 0K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13007VX13V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 13MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 35
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

Bits 3 to 0: These bits operate as in normal serial communication. For details see section 13.2.7,
Serial Status Register (SSR). The setting conditions for transmit end (TEND, bit 2), however, are
modified as follows.
Bit 2
TEND
0
1
Note: An etu (elementary time unit) is the time needed to transmit one bit.
Description
Transmission is in progress
[Clearing conditions]
•
•
End of transmission
[Setting conditions]
•
•
•
Software reads TDRE while it is set to 1, then writes 0 in the TDRE flag.
The DMAC writes data in TDR.
The chip is reset or enters standby mode.
The TE bit and FER/ERS bit are both cleared to 0 in SCR.
TDRE is 1 and ERS is 0 at a time 2.5 etu after the last bit of a 1-byte serial
character is transmitted (normal transmission).
Rev.5.00 Sep. 12, 2007 Page 493 of 764
14. Smart Card Interface
REJ09B0396-0500
(Initial value)