HD64F2166VTE33 Renesas Electronics America, HD64F2166VTE33 Datasheet - Page 42

• Manufacturer Part Number: HD64F2166VTE33
• Description: IC H8S MCU FLASH 512K 144-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of HD64F2166VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, LPC, SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 106
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-TQFP, 144-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 23 Power-Down Modes
Table 23.1
Table 23.2
Section 25 Electrical Characteristics
Table 25.1
Table 25.2
Table 25.2
Table 25.3
Table 25.4
Table 25.5
Table 25.6
Table 25.7
Table 25.8
Table 25.9
Table 25.10
Table 25.11
Table 25.12
Table 25.13
Table 25.14
Table 25.15
Table 25.16
Rev. 3.00, 03/04, page xl of xl
Operating Frequency and Wait Time.................................................................... 730
LSI Internal States in Each Mode ......................................................................... 737
Absolute Maximum Ratings ................................................................................. 783
DC Characteristics (1) .......................................................................................... 784
DC Characteristics (2) .......................................................................................... 785
Permissible Output Currents................................................................................. 787
Clock Timing ........................................................................................................ 788
External Clock Input Conditions .......................................................................... 789
Subclock Input Conditions.................................................................................... 789
Control Signal Timing .......................................................................................... 792
Bus Timing ........................................................................................................... 794
Multiplex Bus Timing........................................................................................... 800
Timing of On-Chip Peripheral Modules ........................................................... 803
I
LPC Module Timing......................................................................................... 808
JTAG Timing.................................................................................................... 809
A/D Conversion Characteristics
D/A Conversion Characteristics ....................................................................... 812
Flash Memory Characteristics .......................................................................... 813
(AN7 to AN0 Input: 134/266-State Conversion).............................................. 811
2
C Bus Timing ................................................................................................. 807