HD64F2166VTE33 Renesas Electronics America, HD64F2166VTE33 Datasheet - Page 831

• Manufacturer Part Number: HD64F2166VTE33
• Description: IC H8S MCU FLASH 512K 144-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of HD64F2166VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, LPC, SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 106
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-TQFP, 144-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Table 25.5 External Clock Input Conditions
Condition: VCC = 3.0 V to 3.6 V, VSS = 0 V, φ = 5 MHz to 33 MHz
Note:
Table 25.6 Subclock Input Conditions
Condition: VCC = 3.0 V to 3.6 V, VSS = 0 V, φ SUB = 32.768 kHz, 5 MHz to 33 MHz
Item
External clock input low level
pulse width
External clock input high level
pulse width
External clock input rising time t
External clock input falling time t
Clock low level pulse width
Clock high level pulse width
External clock output
stabilization delay time
Item
Subclock input low level pulse
width
Subclock input high level pulse
width
Subclock input rising time
Subclock input falling time
Clock low level pulse width
Clock high level pulse width
*
t
DEXT
includes a RES pulse width (t
φ
Figure 25.4 System Clock Timing
Symbol
t
t
t
t
t
Symbol
t
t
t
t
t
t
EXL
EXH
EXr
EXf
CL
CH
DEXT
EXCLL
EXCLH
EXCLr
EXCLf
CL
CH
*
Min.




0.4
0.4
t
RESW
CH
Min.
10
10


0.4
0.4
500
).
t
cyc
t
Cf
t
CL
Typ.
15.26
15.26




t
Max.
Cr


5
5
0.6
0.6

Max.


10
10
0.6
0.6
Rev. 3.00, 03/04, page 789 of 830
Unit
ns
ns
ns
ns
t
t
µs
cyc
cyc
Unit
µs
µs
ns
ns
t
t
cyc
cyc
Test
Conditions
Figure 25.7
Figure 25.4
Figure 25.8
Measureme
nt Condition
Figure 25.9
Figure 25.4