UPD70F3737GC-UEU-AX Renesas Electronics America, UPD70F3737GC-UEU-AX Datasheet - Page 777
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UPD70F3737GC-UEU-AX
Manufacturer Part Number
UPD70F3737GC-UEU-AX
Description
MCU 32BIT V850ES/JX3-L 100-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3-Lr
Datasheet
1.UPD70F3737GC-UEU-AX.pdf
(861 pages)
Specifications of UPD70F3737GC-UEU-AX
Package / Case
*
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Speed
20MHz
Number Of I /o
84
Core Processor
RISC
Program Memory Type
FLASH
Ram Size
8K x 8
Program Memory Size
128KB (128K x 8)
Data Converters
A/D 12x10b, D/A 2x8b
Oscillator Type
Internal
Peripherals
DMA, LVD, PWM, WDT
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Core Size
32-Bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
UPD70F3737GC-UEU-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 777 of 861
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29.1 Debugging with DCU
chip debug emulator (MINICUBE).
29.1.1 Connection circuit example
Figure 29-1. Circuit Connection Example When Debug Interface Pins Are Used for Communication Interface
Programs can be debugged using the debug interface pins (DRST, DCK, DMS, DDI, and DDO) to connect the on-
Notes 1. Example of pin connection when MINICUBE is not connected
2. A pull-down resistor is provided on chip.
3. For flash memory rewriting
MINICUBE
RESET
FLMD0
DRST
DMS
DDO
GND
VDD
DCK
DDI
CHAPTER 29 ON-CHIP DEBUG FUNCTION
Preliminary User’s Manual U18953EJ1V0UD
Note 1
EV
DCK
DMS
DDI
DDO
DRST
RESET
FLMD0
FLMD1/PDL5
EV
V850ES/JG3-L
DD
SS
Note 2
Note 3
777
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