UPD70F3737GC-UEU-AX Renesas Electronics America, UPD70F3737GC-UEU-AX Datasheet - Page 783

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UPD70F3737GC-UEU-AX

Manufacturer Part Number
UPD70F3737GC-UEU-AX
Description
MCU 32BIT V850ES/JX3-L 100-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3-Lr
Datasheet

Specifications of UPD70F3737GC-UEU-AX

Package / Case
*
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Speed
20MHz
Number Of I /o
84
Core Processor
RISC
Program Memory Type
FLASH
Ram Size
8K x 8
Program Memory Size
128KB (128K x 8)
Data Converters
A/D 12x10b, D/A 2x8b
Oscillator Type
Internal
Peripherals
DMA, LVD, PWM, WDT
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Core Size
32-Bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3737GC-UEU-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
29.2 Debugging Without Using DCU
(RXDA0 and TXDA0), pins for CSIB0 (SIB0, SOB0, SCKB0, and HS (PMC0)), or pins for CSIB3 (SIB3, SOB3, SCKB3,
and HS (PMC0)) as debug interfaces, without using the DCU.
29.2.1 Circuit connection examples
Figure 29-3. Circuit Connection Example When UARTA0/CSIB0/CSIB3 Is Used for Communication Interface
The following describes how to implement an on-chip debug function using MINICUBE2 with pins for UARTA0
Notes 1. Connect TXDA0/SOB0/SOB3 (transmit side) of the V850ES/JG3-L to RXD/SI (receive side) of the
Remark See Table 29-3 for pins used when UARTA0, CSIB0, or CSIB3 is used for communication interface.
2. This pin may be used to supply a clock from MINICUBE2 during flash memory programming. For
3. The V850ES/JG3-L-side pin connected to this pin (FLMD0, FLMD1) can be used as an alternate-
4. This connection is designed assuming that the RESET signal is output from the N-ch open-drain
5. The circuit enclosed by a dashed line is designed for flash self programming, which controls the
target connector, and TXD/SO (transmit side) of the target connector to RXDA0/SIB0/SIB3 (receive
side) of the V850ES/JG3-L.
details, see CHAPTER 28 FLASH MEMORY.
function pin other than while the memory is rewritten during a break in debugging, because this pin
is in Hi-Z state.
buffer (output resistance: 100 Ω or less).
FLMD0 pin via ports. Use the port for inputting or outputting the high level. When flash self
programming is not performed, a pull-down resistance for the FLMD0 pin can be within 1 to 10 kΩ.
RESET_IN
RESET_OUT
QB-MINI2
TXD/SO
RXD/SI
FLMD1
FLMD0
CLK
GND
VDD
SCK
Note 1
Note 1
Note 2
Note 3
Note 3
Note 4
HS
CHAPTER 29 ON-CHIP DEBUG FUNCTION
V
DD
Preliminary User’s Manual U18953EJ1V0UD
10
1 to 10
1 to 10
1 to 10
V
V
DD
DD
1
V
DD
3 to 10
1 to 10
10
V
RESET signal
DD
100
Ω
V
RESET
TXDA0/SOB0/SOB3
V
RXDA0/SIB0/SIB3
SCKB0/SCKB3
HS (PCM0)
FLMD1
FLMD0
Port X
DD
SS
V850ES/JG3-L
Reset circuit
Note 5
783

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