UPD70F3713GC-8BS-A Renesas Electronics America, UPD70F3713GC-8BS-A Datasheet - Page 15

• Manufacturer Part Number: UPD70F3713GC-8BS-A
• Description: MCU 32BIT V850ES/LX2 64-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Ix2r

Specifications of UPD70F3713GC-8BS-A

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: CSI, UART/USART
• Peripherals: LVD, PWM, WDT
• Number Of I /o: 39
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 6K x 8
• Voltage - Supply (vcc/vdd): 3.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

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CHAPTER 17 REGULATOR ..................................................................................................................605
CHAPTER 18 FLASH MEMORY...........................................................................................................607
CHAPTER 19 ELECTRICAL SPECIFICATIONS..................................................................................632
CHAPTER 20 PACKAGE DRAWING ...................................................................................................651
CHAPTER 21 RECOMMENDED SOLDERING CONDITIONS ...........................................................652
APPENDIX A CAUTIONS.......................................................................................................................653
APPENDIX B REGISTER INDEX..........................................................................................................654
APPENDIX C INSTRUCTION SET LIST..............................................................................................659
APPENDIX D REVISION HISTORY ......................................................................................................669
17.1 Overview ..................................................................................................................................605
17.2 Operation .................................................................................................................................606
18.1 Features ...................................................................................................................................607
18.2 Memory Configuration............................................................................................................608
18.3 Functional Overview...............................................................................................................609
18.4 Rewriting by Dedicated Flash Memory Programmer ..........................................................613
18.5 Rewriting by Self Programming (
A.1
C.1
C.2
D.1
18.4.1 Programming environment ......................................................................................................... 613
18.4.2 Communication mode................................................................................................................. 614
18.4.3 Flash memory control ................................................................................................................. 619
18.4.4 Selection of communication mode .............................................................................................. 620
18.4.5 Communication commands ........................................................................................................ 621
18.4.6 Pin connection ............................................................................................................................ 622
18.5.1 Overview..................................................................................................................................... 627
18.5.2 Features ..................................................................................................................................... 628
18.5.3 Standard self programming flow ................................................................................................. 629
18.5.4 Flash functions ........................................................................................................................... 630
18.5.5 Pin processing ............................................................................................................................ 630
18.5.6 Internal resources used .............................................................................................................. 631
Restriction on Conflict Between sld Instruction and Interrupt Request...........................653
A.1.1
A.1.2
Conventions ............................................................................................................................659
Instruction Set (in Alphabetical Order).................................................................................662
Major Revisions in This Edition.............................................................................................669
Description.................................................................................................................................. 653
Countermeasure......................................................................................................................... 653
User’s Manual U17716EJ2V0UD
μ
PD70F3714 only) ...........................................................627
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