HD64F3048BF25 Renesas Electronics America, HD64F3048BF25 Datasheet - Page 211

• Manufacturer Part Number: HD64F3048BF25
• Description: IC H8 MCU FLASH 128K 100QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3048BF25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 8MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Example 4: Connection to Multiple 4-Mbit DRAM Chips (16-Mbyte Mode)
Figure 7.13 shows an example of interconnections to two 2CAS 4-Mbit DRAM chips, and the
corresponding address map. Up to four DRAM chips can be connected to area 3 by decoding
upper address bits A
Figure 7.14 shows a setup procedure to be followed by a program for this example. The DRAM in
this example has 9-bit row addresses and 9-bit column addresses. Both chips must be refreshed
simultaneously, so the RFSH pin must be used.
Figure 7.12 Setup Procedure for 2CAS
19
and A
20
.
Column Address (16-Mbyte Mode)
Set bits CKS2 to CKS0 in RTMCSR
Set P8 DDR to 1 for
Wait for DRAM to be initialized
Set area 3 for 16-bit access
DRAM can be accessed
Write H'3B in RFSHCR
CAS
CAS 4-Mbit DRAM with 9-Bit Row Address and 9-Bit
CAS
1
Set RTCOR
CS
Rev. 3.00 Sep 27, 2006 page 183 of 872
3
output
Section 7 Refresh Controller
REJ09B0325-0300